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LM3S5739-IQC50-A0T

Texas Instruments

LM3S5739-IQC50-A0T by Texas Instruments

Texas Instruments LM3S5739-IQC50-A0T is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 65536 RAM bytes. Operating at -40 to 85°C, it has PWM channels, ADC support, and 61 I/O lines. Ideal for industrial applications requiring a compact (14mm x 14mm) microcontroller with low power consumption (2.25-2.75V).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,359 parts In-Stock

1+ parts

-

100+ parts

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7,359

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Digiode

USA . 3,943 parts In-Stock

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3,943

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 350 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

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350

$11.000

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$16.541

100+ parts

-

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312

$16.541

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Microchip USA

USA . 2,486 parts In-Stock

1+ parts

$28.770

100+ parts

$28.360

1k+ parts

$28.150

10k+ parts

$27.950

2,486

$28.770

$28.360

$28.150

$27.950

Parana Technologies

USA . 1,810 parts In-Stock

1+ parts

$51.961

100+ parts

-

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1,810

$51.961

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DigiPath Technology Company

USA . 192 parts In-Stock

1+ parts

$57.215

100+ parts

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10k+ parts

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192

$57.215

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ChromeModa Solutions

Germany . 5,077 parts In-Stock

1+ parts

$58.383

100+ parts

$47.874

1k+ parts

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10k+ parts

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5,077

$58.383

$47.874

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IDEA Electronic Components Group

UK . 1,293 parts In-Stock

1+ parts

$58.383

100+ parts

$55.464

1k+ parts

$52.545

10k+ parts

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1,293

$58.383

$55.464

$52.545

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Corphita

USA . 3,209 parts In-Stock

1+ parts

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3,209

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Overview

Discover the cutting-edge LM3S5739-IQC50-A0T by Texas Instruments, setting a new standard in microcontroller technology. Designed with precision and innovation, this device is perfect for a wide range of applications, offering unparalleled performance and reliability. With a focus on quality and efficiency, Texas Instruments delivers a product that exceeds expectations, providing customers with value and benefits that are unmatched in the industry. Experience the difference with the LM3S5739-IQC50-A0T and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is long-lasting and easy to handle.

Surface Mount: YES

Allows for easy and efficient installation onto printed circuit boards.

Maximum Supply Voltage: 2.75 V

Can handle higher supply voltages for versatile applications.

Package Shape: SQUARE

Compact square shape saves space on the PCB.

Bit Size: 32

High bit size allows for complex operations and calculations.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 100

Sufficient terminals for connecting various components and peripherals.

Package Style (Meter): FLATPACK

Flatpack design is space-efficient and easy to handle during assembly.

Minimum Supply Voltage: 2.25 V

Can operate at lower supply voltages for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures for reliable performance in demanding conditions.

CPU Family: CORTEX-M3

Utilizes advanced Cortex-M3 architecture for efficient processing capabilities.

Minimum Operating Temperature: -40 °C

Operates in extremely low temperatures, making it suitable for various environments.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog to digital conversions for sensor interfacing.

Terminal Position: QUAD

Quad terminal position allows for easy alignment and soldering on the PCB.

ROM Words: 131072

Large ROM size for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design is suitable for compact electronic devices.

Width: 14 mm

Compact width saves space on the PCB.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast and responsive operation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for efficient soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints.

Length: 14 mm

Compact length saves space on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control over peripherals.

RAM Bytes: 65536

Large RAM capacity for storing data and variables during operation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for reliable and secure connections on the PCB.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Integrated PWM channels for precise control over motor speeds and power output.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and efficient PCB design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates appropriate moisture resistance for standard handling.

Speed: 50 rpm

Operates at a speed of 50 rpm for various applications requiring controlled rotation.

No. of I/O Lines: 61

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5739-IQC50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

61

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5739-IQC50-A0T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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