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LM3S5662-IQR50-A0

Texas Instruments

LM3S5662-IQR50-A0 by Texas Instruments

LM3S5662-IQR50-A0 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 32768 RAM bytes, and operates at a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring a microcontroller with 33 I/O lines, PWM channels, and ADC channels for precise control and monitoring.

Median Price

$9.463

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 644 parts In-Stock

1+ parts

-

100+ parts

$7.570

1k+ parts

$6.770

10k+ parts

$6.380

644

-

$7.570

$6.770

$6.380

DigiKey

USA . 644 parts In-Stock

1+ parts

-

100+ parts

$9.960

1k+ parts

-

10k+ parts

-

644

-

$9.960

-

-

Verical

USA . 644 parts In-Stock

1+ parts

-

100+ parts

$9.463

1k+ parts

$8.463

10k+ parts

$7.975

644

-

$9.463

$8.463

$7.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,022 parts In-Stock

1+ parts

$7.999

100+ parts

-

1k+ parts

-

10k+ parts

-

4,022

$7.999

-

-

-

Vyrian

USA . 4,197 parts In-Stock

1+ parts

-

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4,197

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DigiKey Marketplace

USA . 644 parts In-Stock

1+ parts

-

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644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,989 parts In-Stock

1+ parts

$7.578

100+ parts

-

1k+ parts

-

10k+ parts

-

1,989

$7.578

-

-

-

Microchip USA

USA . 1,478 parts In-Stock

1+ parts

$34.180

100+ parts

$33.690

1k+ parts

$33.450

10k+ parts

$33.200

1,478

$34.180

$33.690

$33.450

$33.200

Parana Technologies

USA . 1,963 parts In-Stock

1+ parts

$76.366

100+ parts

$7,091.783

1k+ parts

$68.730

10k+ parts

-

1,963

$76.366

$7,091.783

$68.730

-

DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$84.089

100+ parts

$77.362

1k+ parts

-

10k+ parts

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748

$84.089

$77.362

-

-

ChromeModa Solutions

Germany . 1,677 parts In-Stock

1+ parts

$85.805

100+ parts

$70.360

1k+ parts

-

10k+ parts

-

1,677

$85.805

$70.360

-

-

IDEA Electronic Components Group

UK . 815 parts In-Stock

1+ parts

$85.805

100+ parts

$81.515

1k+ parts

$77.224

10k+ parts

-

815

$85.805

$81.515

$77.224

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Kepictronics

USA . 644 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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644

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Overview

Unlock endless possibilities with the LM3S5662-IQR50-A0 microcontroller by Texas Instruments. Crafted with precision and expertise, this powerful device opens doors to innovative solutions across various industries. From robotics to automation, this Cortex-M3 family gem offers unmatched performance and reliability. Its sleek design and compact size make it perfect for space-constrained applications. Embrace the future of technology with the LM3S5662-IQR50-A0 and experience the true essence of quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, reducing the risk of damage from overvoltage.

Package Shape: SQUARE

Helps in efficient placement on the PCB and saves space in the overall design.

Bit Size: 32

Offers a good balance between performance and power efficiency for various applications.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external devices and peripherals.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where elevated temperatures may be encountered.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and energy efficiency for embedded applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with sensor inputs.

ROM Words: 131072

Provides ample non-volatile memory for program storage and data retention.

RAM Bytes: 32768

Offers sufficient volatile memory for data storage and manipulation during program execution.

PWM Channels: YES

Enables the generation of pulse-width modulation signals for controlling motors and actuators.

Technical Specifications

Microcontrollers LM3S5662-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5662-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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