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LM3S5656-IQR80-C3

Texas Instruments

LM3S5656-IQR80-C3 by Texas Instruments

LM3S5656-IQR80-C3 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 50 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and multiple I/O lines. With a compact square package style and low supply voltage requirements, it offers efficient performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,403 parts In-Stock

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Digiode

USA . 4,642 parts In-Stock

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One Stop Electronics

USA . 293 parts In-Stock

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$13.000

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293

$13.000

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AZTECH Wire

Italy . 513 parts In-Stock

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$15.444

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513

$15.444

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Parana Technologies

USA . 1,115 parts In-Stock

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$19.980

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$19.918

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$19.980

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$19.918

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ChromeModa Solutions

Germany . 3,188 parts In-Stock

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$22.449

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$18.408

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3,188

$22.449

$18.408

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IDEA Electronic Components Group

UK . 649 parts In-Stock

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$22.449

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$21.327

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$20.204

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649

$22.449

$21.327

$20.204

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Corphita

USA . 3,717 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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DigiPath Technology Company

USA . 1,082 parts In-Stock

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$20.240

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$20.240

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Lixinc

USA . 471 parts In-Stock

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471

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Microchip USA

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Kepictronics

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Overview

Elevate your projects with the LM3S5656-IQR80-C3 microcontroller from Texas Instruments, a leader in innovative technology. Designed for high-performance applications, this compact yet powerful device offers unmatched reliability and efficiency. Its versatile features make it ideal for a variety of uses, from automation to IoT devices. Experience seamless integration and superior performance with Texas Instruments' cutting-edge technology. Unlock endless possibilities with the LM3S5656-IQR80-C3 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V allows for flexibility in power requirements and compatibility with various systems.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and data processing tasks efficiently.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and inputs, expanding its functionality.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory without CPU intervention, improving performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50MHz enables fast execution of instructions, making this microcontroller suitable for high-speed applications.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for easy and quick firmware updates, enhancing the flexibility of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

The microcontroller is specifically designed for embedded system applications, providing all necessary peripherals and interfaces in a single package.

Technical Specifications

Microcontrollers LM3S5656-IQR80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5656-IQR80-C3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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