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LM3S5656-IQR80-C1

Texas Instruments

LM3S5656-IQR80-C1 by Texas Instruments

Texas Instruments' LM3S5656-IQR80-C1 microcontroller features 32-bit architecture, 131072 ROM words, and 32768 RAM bytes. With ADC and DMA channels, it operates in industrial temperatures (-40 to 85 °C) for various applications requiring a max clock frequency of 0.032 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,942 parts In-Stock

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Digiode

USA . 227 parts In-Stock

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227

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One Stop Electronics

USA . 1,534 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 430 parts In-Stock

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$16.805

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Parana Technologies

USA . 2,371 parts In-Stock

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$75.566

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DigiPath Technology Company

USA . 1,591 parts In-Stock

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$83.208

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$76.551

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ChromeModa Solutions

Germany . 2,910 parts In-Stock

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$84.906

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$69.623

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$84.906

$69.623

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IDEA Electronic Components Group

UK . 1,538 parts In-Stock

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$84.906

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$80.661

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$76.415

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$76.415

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Corphita

USA . 1,417 parts In-Stock

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Microchip USA

USA . 455 parts In-Stock

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Overview

Experience the power of innovation with the LM3S5656-IQR80-C1 by Texas Instruments. This cutting-edge microcontroller offers unparalleled performance and reliability, showcasing the superior quality that comes with the Texas Instruments brand. Ideal for a wide range of applications, this product provides customers with unmatched value, efficiency, and versatility. Unlock endless possibilities and elevate your projects to new heights with the LM3S5656-IQR80-C1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for long-term use

Surface Mount: YES

Ease of installation on PCBs and space-saving

Maximum Supply Voltage: 1.32 V

Efficient power consumption and safe operation

Package Shape: SQUARE

Uniform size and easy to handle

Bit Size: 32

High processing capacity for complex tasks

Power Supplies (V): 1.2,3.3

Versatile power options for different applications

No. of Terminals: 64

Sufficient connections for external devices

Package Style (Meter): FLATPACK

Compact design for space-constrained environments

Minimum Supply Voltage: 1.08 V

Operates efficiently at low power levels

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperatures

Minimum Operating Temperature: -40 °C

Ideal for use in harsh cold conditions

ADC Channels: YES

Ability to convert analog signals to digital for processing

DMA Channels: YES

Efficient data transfer capabilities for improved performance

Terminal Position: QUAD

Organized terminal layout for easy connectivity

ROM Words: 131072

Large memory storage for program and data handling

Maximum Seated Height: 1.6 mm

Low profile design for compact installations

Width: 10 mm

Slim form factor for space-saving applications

Maximum Clock Frequency: 0.032 MHz

High-speed processing capabilities for quick operations

Length: 10 mm

Uniform dimensions for easy integration

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications

RAM Bytes: 32768

Sufficient memory for data storage and processing

Technology: CMOS

Low power consumption and high noise immunity

Terminal Form: GULL WING

Secure terminal configuration for stable connections

Nominal Supply Voltage: 1.2 V

Stable operating voltage for consistent performance

PWM Channels: YES

Precise control over pulse width modulation signals

ROM Programmability: FLASH

Easily reprogrammable memory for flexible applications

Terminal Pitch: 0.5 mm

Fine pitch for high-density mounting on PCBs

Speed: 80 rpm

Efficient processing speed for real-time applications

No. of I/O Lines: 33

Sufficient input/output capabilities for connectivity

Technical Specifications

Microcontrollers LM3S5656-IQR80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5656-IQR80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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