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LM3S5651-IQC80-C3

Texas Instruments

LM3S5651-IQC80-C3 by Texas Instruments

LM3S5651-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and control capabilities. With a supply voltage range of 3V to 3.6V, it offers versatile performance in compact square packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,111 parts In-Stock

1+ parts

-

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6,111

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Digiode

USA . 3,326 parts In-Stock

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3,326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$18.350

100+ parts

-

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494

$18.350

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One Stop Electronics

USA . 569 parts In-Stock

1+ parts

$28.000

100+ parts

-

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569

$28.000

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Parana Technologies

USA . 2,362 parts In-Stock

1+ parts

$72.595

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-

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2,362

$72.595

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DigiPath Technology Company

USA . 651 parts In-Stock

1+ parts

$79.936

100+ parts

-

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651

$79.936

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IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$81.567

100+ parts

$77.489

1k+ parts

$73.410

10k+ parts

-

721

$81.567

$77.489

$73.410

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ChromeModa Solutions

Germany . 236 parts In-Stock

1+ parts

$81.567

100+ parts

$66.885

1k+ parts

-

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236

$81.567

$66.885

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Corphita

USA . 3,697 parts In-Stock

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3,697

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Microchip USA

USA . 131 parts In-Stock

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131

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Overview

Discover the unparalleled quality and reliability of the LM3S5651-IQC80-C3 microcontroller by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers cutting-edge technology that meets the demands of various applications in the industry. This microcontroller offers customers exceptional value, providing advanced features such as ADC and DMA channels, PWM capabilities, and ROM programmability. Trust in Texas Instruments to deliver top-notch performance and functionality for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides a durable and cost-effective solution for packaging, ensuring the longevity and reliability of the microcontroller.

Surface Mount: YES

Surface mount technology enables easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in power supply options, enabling compatibility with a wide range of applications.

Bit Size: 32

A 32-bit microcontroller offers higher computational power and can handle more complex tasks efficiently.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for various peripherals and external components, making the microcontroller versatile in application.

Maximum Clock Frequency: 16 MHz

With a high maximum clock frequency, this microcontroller can execute instructions at a faster rate, enhancing overall performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, ensuring adaptability to evolving requirements and technologies.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers LM3S5651-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5651-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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