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LM3S5651-IQC80-C1

Texas Instruments

LM3S5651-IQC80-C1 by Texas Instruments

LM3S5651-IQC80-C1 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality. With a temperature range from -40 to 85 °C, it offers 67 I/O lines in a compact flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,224 parts In-Stock

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Digiode

USA . 1,265 parts In-Stock

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1,265

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Distributors (Availability)

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AZTECH Wire

Italy . 730 parts In-Stock

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$13.090

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730

$13.090

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One Stop Electronics

USA . 1,273 parts In-Stock

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$29.000

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Parana Technologies

USA . 982 parts In-Stock

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$54.278

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$54.278

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DigiPath Technology Company

USA . 2,145 parts In-Stock

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$59.767

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$59.767

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ChromeModa Solutions

Germany . 3,990 parts In-Stock

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$60.987

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$50.009

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3,990

$60.987

$50.009

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IDEA Electronic Components Group

UK . 71 parts In-Stock

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$60.987

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$57.938

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$54.888

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71

$60.987

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$54.888

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QUARKTWIN TECHNOLOGY LTD

USA . 7,466 parts In-Stock

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Corphita

USA . 2,954 parts In-Stock

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Microchip USA

USA . 476 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S5651-IQC80-C1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments consistently delivers top-quality microcontrollers that excel in a variety of applications. From industrial automation to consumer electronics, this versatile product offers unmatched value and performance. With its advanced features and reliable design, the LM3S5651-IQC80-C1 provides customers with the tools they need to take their projects to the next level. Experience the difference of Texas Instruments and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the overall design.

Maximum Supply Voltage: 1.32 V

The microcontroller can operate efficiently within a specified maximum voltage range, ensuring optimal performance and reliability.

Package Shape: SQUARE

Square package shape provides a compact footprint, ideal for space-constrained designs.

Bit Size: 32

32-bit architecture allows for higher computational power and performance, suitable for complex applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with different peripherals.

No. of Terminals: 100

High number of terminals allow for connectivity to a wide range of external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers easy integration onto PCBs and efficient heat dissipation for reliable operation.

Minimum Supply Voltage: 1.08 V

The microcontroller can operate at low supply voltages, ideal for energy-efficient designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures the microcontroller can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to be used in a wide range of environments, including industrial settings.

ADC Channels: YES

Built-in ADC channels allow for analog signal conversion, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between memory and peripherals, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides ease of PCB layout and routing, simplifying the hardware design process.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program code, data, and firmware in the microcontroller.

Maximum Seated Height: 1.6 mm

Low seated height enables the microcontroller to be used in compact and slim devices, saving space in the design.

Width: 14 mm

Narrow width dimension makes the microcontroller suitable for applications with limited board space.

Maximum Clock Frequency: 0.032 MHz

High clock frequency capability enables fast and efficient operation, suitable for real-time applications.

Length: 14 mm

Compact length dimension enables the microcontroller to fit in small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, this product offers dedicated processing power for embedded applications.

RAM Bytes: 32768

Generous RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical strength and easy soldering during PCB assembly.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Built-in PWM channels enable precise control of analog signals, suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, enhancing the longevity and versatility of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch offers high-density packaging, ideal for miniaturized and compact designs.

Speed: 80 rpm

High processing speed of 80 rpm ensures quick response times and efficient operation in time-critical applications.

No. of I/O Lines: 67

Abundance of I/O lines provide versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5651-IQC80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5651-IQC80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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