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LM3S3Z26-IQR50-C1

Texas Instruments

LM3S3Z26-IQR50-C1 by Texas Instruments

LM3S3Z26-IQR50-C1 by Texas Instruments is a 32-bit microcontroller with 64 terminals, 6144 bytes of RAM, and 16384 ROM words. It operates in industrial temperatures (-40 to 85°C) and features ADC and DMA channels for versatile applications. With a clock frequency of 0.032 MHz, it is suitable for various embedded systems requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,774 parts In-Stock

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Digiode

USA . 4,249 parts In-Stock

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4,249

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Distributors (Availability)

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AZTECH Wire

Italy . 722 parts In-Stock

1+ parts

$8.766

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722

$8.766

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Parana Technologies

USA . 162 parts In-Stock

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$21.662

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-

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$22.082

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162

$21.662

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$22.082

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DigiPath Technology Company

USA . 439 parts In-Stock

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$23.852

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$21.944

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439

$23.852

$21.944

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ChromeModa Solutions

Germany . 3,844 parts In-Stock

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$24.339

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$19.958

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3,844

$24.339

$19.958

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

1+ parts

$24.339

100+ parts

$23.122

1k+ parts

$21.905

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1,324

$24.339

$23.122

$21.905

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One Stop Electronics

USA . 745 parts In-Stock

1+ parts

$33.000

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745

$33.000

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Corphita

USA . 3,554 parts In-Stock

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Microchip USA

USA . 131 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the LM3S3Z26-IQR50-C1 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments offers cutting-edge technology and top-notch quality. This microcontroller is perfect for a wide range of applications, providing customers with exceptional value and benefits. From industrial automation to consumer electronics, this versatile device delivers superior functionality and efficiency. Upgrade your projects with the LM3S3Z26-IQR50-C1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to external elements, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Provides stable power supply within safe limits, ensuring the longevity and reliability of the microcontroller.

Package Shape: SQUARE

Space-efficient design that allows for compact integration into electronic devices.

Bit Size: 32

Higher bit size allows for faster and more efficient processing of data, making the microcontroller suitable for complex tasks.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, offering flexibility in system design and compatibility with different components.

No. of Terminals: 64

Sufficient number of terminals for connectivity and interfacing with external devices, making the microcontroller versatile in use.

Package Style (Meter): FLATPACK

Flatpack design enables easy assembly and maintenance of the microcontroller, enhancing overall usability.

Minimum Supply Voltage: 1.08 V

Allows for operation at lower voltages, conserving energy and reducing heat dissipation in the system.

Maximum Operating Temperature: 85 °C

Wide temperature range ensures reliable performance in harsh environments or extended operation durations.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a diverse range of applications.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to interface with analog sensors or devices for data acquisition.

DMA Channels: YES

Support for direct memory access allows for efficient data transfer without CPU intervention, improving system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and facilitates easy connection to external components.

ROM Words: 16384

Ample ROM capacity for storing program instructions and data, accommodating complex programs and algorithms.

Maximum Seated Height: 1.6 mm

Low profile design saves space and enables compact integration in slim electronic devices.

Width: 10 mm

Compact width dimension allows for efficient PCB layout and space-saving design implementations.

Maximum Clock Frequency: 0.032 MHz

High clock frequency supports fast processing speeds, making the microcontroller suitable for time-critical applications.

Length: 10 mm

Compact length dimension facilitates space-efficient system designs and miniaturization of electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

Specialized microcontroller design optimizes functionality for various embedded applications, providing high performance and efficiency.

RAM Bytes: 6144

Sufficient RAM capacity for data storage and processing, enabling the microcontroller to handle multitasking and complex operations.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, enhancing the overall efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable electrical connections, minimizing assembly errors and ensuring signal integrity.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and efficient operation of the microcontroller under varying load conditions.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow for precise control of connected devices, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates, ensuring adaptability and future-proofing of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB layouts and compact designs, optimizing space utilization in electronic systems.

Speed: 50 rpm

High processing speed of 50 revolutions per minute enables rapid data processing and response times, suitable for real-time applications.

No. of I/O Lines: 33

Sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing the versatility and connectivity of the microcontroller.

Technical Specifications

Microcontrollers LM3S3Z26-IQR50-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3Z26-IQR50-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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