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LM3S3Z26-IQR50-C0T

Texas Instruments

LM3S3Z26-IQR50-C0T by Texas Instruments

Texas Instruments' LM3S3Z26-IQR50-C0T is a 32-bit microcontroller with 64 terminals, operating at up to 50 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a wide temperature range (-40 to 85°C) and low supply voltage (1.08-1.32 V).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,055 parts In-Stock

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Digiode

USA . 3,817 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 678 parts In-Stock

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$1.000

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678

$1.000

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AZTECH Wire

Italy . 255 parts In-Stock

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$16.006

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$16.006

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Parana Technologies

USA . 103 parts In-Stock

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$22.650

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$23.308

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103

$22.650

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$23.308

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IDEA Electronic Components Group

UK . 1,550 parts In-Stock

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$25.449

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$24.177

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$22.904

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1,550

$25.449

$24.177

$22.904

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ChromeModa Solutions

Germany . 218 parts In-Stock

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$25.449

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$20.868

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218

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$20.868

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Corphita

USA . 1,899 parts In-Stock

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DigiPath Technology Company

USA . 596 parts In-Stock

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$22.945

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Microchip USA

USA . 195 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S3Z26-IQR50-C0T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are ideal for a wide range of applications. Whether you're working on robotics, automation, or IoT projects, this microcontroller offers unmatched performance and reliability. With advanced features like ADC and DMA channels, along with PWM capabilities, the LM3S3Z26-IQR50-C0T provides the tools you need to bring your ideas to life. Trust in Texas Instruments to provide cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Surface Mount: YES

Convenient for automated assembly processes, saving time and labor costs.

Maximum Supply Voltage: 1.32 V

Allows for safe operation within specified voltage limits, protecting the microcontroller from damage.

Package Shape: SQUARE

Efficient use of space on the PCB, enabling compact designs.

Bit Size: 32

High processing power and capability for complex tasks and computations.

No. of Terminals: 64

Sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Low profile design for space-saving and efficient PCB layout.

Minimum Supply Voltage: 1.08 V

Wide operating voltage range for flexibility in power supply options.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature operation capabilities.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions, making it suitable for a variety of applications.

ADC Channels: YES

Analog-to-digital conversion capability for interacting with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels for fast data transfer and efficient processing.

Terminal Position: QUAD

Organized terminal layout for ease of connection and PCB routing.

Maximum Seated Height: 1.6 mm

Low profile for compact designs and space-constrained applications.

Width: 10 mm

Compact form factor for integration into various electronic devices.

Maximum Clock Frequency: 50 MHz

High-speed processing capability for quick response and efficient operation.

Length: 10 mm

Small footprint for space-saving and portable device designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Specifically tailored for microcontroller applications, ensuring optimal performance.

Technology: CMOS

Efficient and low-power consumption technology for energy-efficient operation.

Terminal Form: GULL WING

Robust terminal design for secure soldering and reliable electrical connections.

Nominal Supply Voltage: 1.2 V

Stable voltage supply for consistent and reliable operation.

PWM Channels: YES

Pulse-width modulation channels for precise control of connected devices.

ROM Programmability: FLASH

Flash memory for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals for dense PCB layouts and efficient routing.

Speed: 50 rpm

High processing speed for quick response times and efficient operation.

No. of I/O Lines: 33

Sufficient input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S3Z26-IQR50-C0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3Z26-IQR50-C0T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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