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LM3S3826-IQR50-C5

Texas Instruments

LM3S3826-IQR50-C5 by Texas Instruments

LM3S3826-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it ideal for industrial applications requiring high-speed processing and control capabilities. With features like ADC and DMA channels, this microcontroller offers versatile functionality in a compact package suitable for various embedded systems.

Median Price

$6.210

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 463 parts In-Stock

1+ parts

-

100+ parts

$5.380

1k+ parts

$4.810

10k+ parts

$4.530

463

-

$5.380

$4.810

$4.530

DigiKey

USA . 463 parts In-Stock

1+ parts

-

100+ parts

$6.210

1k+ parts

-

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463

-

$6.210

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Verical

USA . 463 parts In-Stock

1+ parts

-

100+ parts

$6.725

1k+ parts

$6.013

10k+ parts

$5.662

463

-

$6.725

$6.013

$5.662

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 657 parts In-Stock

1+ parts

$5.672

100+ parts

-

1k+ parts

-

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657

$5.672

-

-

-

Greenchips

USA . 161 parts In-Stock

1+ parts

$5.956

100+ parts

$5.595

1k+ parts

$5.063

10k+ parts

$5.063

161

$5.956

$5.595

$5.063

$5.063

Vyrian

USA . 8,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,647

-

-

-

-

DigiKey Marketplace

USA . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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463

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,915 parts In-Stock

1+ parts

$5.373

100+ parts

-

1k+ parts

-

10k+ parts

-

1,915

$5.373

-

-

-

Component Stockers USA

USA . 835 parts In-Stock

1+ parts

$6.030

100+ parts

$5.670

1k+ parts

-

10k+ parts

-

835

$6.030

$5.670

-

-

Microchip USA

USA . 403 parts In-Stock

1+ parts

$17.390

100+ parts

$17.140

1k+ parts

$17.020

10k+ parts

$16.890

403

$17.390

$17.140

$17.020

$16.890

Parana Technologies

USA . 2,233 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

$18.887

10k+ parts

-

2,233

$18.800

-

$18.887

-

DigiPath Technology Company

USA . 2,128 parts In-Stock

1+ parts

$20.702

100+ parts

$19.045

1k+ parts

-

10k+ parts

-

2,128

$20.702

$19.045

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-

ChromeModa Solutions

Germany . 6,712 parts In-Stock

1+ parts

$21.124

100+ parts

$17.322

1k+ parts

-

10k+ parts

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6,712

$21.124

$17.322

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IDEA Electronic Components Group

UK . 1,664 parts In-Stock

1+ parts

$21.124

100+ parts

$20.068

1k+ parts

$19.012

10k+ parts

-

1,664

$21.124

$20.068

$19.012

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Authorized Procurement Solutions

USA . 460,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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460,000

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A-Z Elektronik GmbH

Germany . 1,200 parts In-Stock

1+ parts

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1,200

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Overview

Experience the cutting-edge technology of the LM3S3826-IQR50-C5 microcontroller by Texas Instruments. With a powerful Cortex-M3 CPU family, this device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the LM3S3826-IQR50-C5 delivers exceptional speed and efficiency, making it the perfect choice for your next project. Trust in Texas Instruments' reputation for quality and innovation, and unlock the full potential of your designs with this advanced microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring longevity of the microcontroller.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.365 V

Allows for a stable power supply within safe operating limits, preventing damage to the microcontroller.

Package Shape: SQUARE

Enables efficient use of space on the circuit board, optimizing the overall design layout.

Bit Size: 32

Offers high processing capabilities and performance for handling complex tasks efficiently.

Power Supplies (V): 1.2,3.3

Provides flexibility in power options, allowing compatibility with various voltage requirements in different applications.

No. of Terminals: 64

Offers ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances the overall compactness and efficiency of the design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.235 V

Ensures reliable operation even at lower voltage levels, increasing the versatility of the microcontroller.

Maximum Operating Temperature: 85 °C

Allows for operation in harsh environmental conditions without compromising performance or reliability.

CPU Family: CORTEX-M3

Features a powerful and efficient CPU architecture that enhances overall processing speed and performance.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term connectivity stability.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog devices, increasing the microcontroller's versatility.

DMA Channels: YES

Allows for efficient data transfer between memory and peripherals, enhancing performance and reducing CPU workload.

Terminal Position: QUAD

Facilitates easy connection and integration into the circuit board layout, simplifying the assembly process.

ROM Words: 262144

Offers ample memory capacity for storing program instructions and data, accommodating complex applications.

Maximum Seated Height: 1.6 mm

Ensures a low-profile design that is suitable for compact electronic devices and applications with height constraints.

Width: 10 mm

Compact width dimension that allows for space-efficient placement on the circuit board.

Maximum Clock Frequency: 16.384 MHz

Provides high-speed processing capabilities for handling demanding tasks and real-time applications efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Specifies the reflow process time for soldering, ensuring proper assembly and reliability of the product.

Peak Reflow Temperature °C: 260

Indicates the temperature level for solder reflow process, ensuring proper soldering of the microcontroller onto the PCB.

Length: 10 mm

Compact length dimension that allows for space-efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, making it suitable for rugged applications and harsh environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for controlling various functions and peripherals, providing a comprehensive solution in a single integrated package.

RAM Bytes: 32768

Offers sufficient random access memory for storing and processing data during operation, ensuring smooth performance.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation, optimizing energy efficiency in the device.

Terminal Form: GULL WING

Gull wing terminals provide reliable connectivity and allow for easy soldering onto the circuit board, ensuring stable electrical connections.

Nominal Supply Voltage: 1.3 V

Standard supply voltage for reliable and stable operation of the microcontroller in various applications.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog outputs, enabling a wide range of applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM allows for reprogramming and updating firmware easily, providing flexibility for future enhancements and optimizations.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and space-saving layout on the PCB, enabling compact and efficient designs.

Moisture Sensitivity Level (MSL): 3

Indicates the sensitivity to moisture during storage and handling, ensuring proper precautions are taken to protect the microcontroller from humidity-induced damage.

Speed: 50 rpm

Specifies the rotational speed for specific applications where motor control or speed sensing is required.

No. of I/O Lines: 33

Offers a sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing the microcontroller's connectivity and versatility.

Technical Specifications

Microcontrollers LM3S3826-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3826-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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