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LM3S3826-IQR50-C3T

Texas Instruments

LM3S3826-IQR50-C3T by Texas Instruments

LM3S3826-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 32768 bytes of RAM, ADC and DMA channels, and ROM programmability for various industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,670 parts In-Stock

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Digiode

USA . 2,258 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 777 parts In-Stock

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$17.201

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777

$17.201

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One Stop Electronics

USA . 1,498 parts In-Stock

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$20.000

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Parana Technologies

USA . 804 parts In-Stock

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$27.011

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$31.209

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804

$27.011

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DigiPath Technology Company

USA . 1,347 parts In-Stock

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$29.742

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$27.363

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1,347

$29.742

$27.363

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ChromeModa Solutions

Germany . 3,854 parts In-Stock

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$30.349

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$24.886

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$30.349

$24.886

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

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$30.349

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$28.832

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$27.314

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1,748

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$28.832

$27.314

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Corphita

USA . 3,779 parts In-Stock

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Microchip USA

USA . 372 parts In-Stock

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Overview

Elevate your projects to the next level with the LM3S3826-IQR50-C3T microcontroller from Texas Instruments. Designed with precision and expertise, this powerful device offers unparalleled performance and reliability. Whether you're working on IoT applications, robotics, or automation systems, this microcontroller is the perfect choice for your needs. Experience seamless integration, advanced features, and exceptional value with the LM3S3826-IQR50-C3T. Unlock endless possibilities and unleash your creativity with this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape package makes it easy to mount and integrate into various applications.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages allows for compatibility with different power sources.

No. of Terminals: 64

Plenty of terminals for connecting to external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack style provides a low profile and compact form factor.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability.

ADC Channels: YES

Analog-to-digital converter channels enable interfacing with sensors and analog signals.

DMA Channels: YES

Direct memory access channels improve data transfer speeds and efficiency.

Terminal Position: QUAD

Quad terminal placement allows for easy soldering and better mechanical stability.

ROM Words: 262144

Large amount of ROM words for program storage and data retention.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 10 mm

Compact width for fitting into tight spaces.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust assembly.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Versatile microcontroller for a wide range of applications.

RAM Bytes: 32768

Ample RAM for data storage and processing requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable solder connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for control and signal modulation.

ROM Programmability: FLASH

Flash programmable ROM for flexible firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 suitable for standard assembly processes.

Speed: 50 rpm

Operates at a speed of 50 revolutions per minute.

No. of I/O Lines: 33

Sufficient number of I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S3826-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3826-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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