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LM3S3739-IQC50-A0

Texas Instruments

LM3S3739-IQC50-A0 by Texas Instruments

Texas Instruments LM3S3739-IQC50-A0 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications with ADC channels, PWM support, and connectivity options like I2C, SSI, UART, and USB. Operating temperature range from -40 to 85°C makes it suitable for various embedded systems.

Median Price

$12.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 71 parts In-Stock

1+ parts

$12.500

100+ parts

$12.250

1k+ parts

$12.000

10k+ parts

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71

$12.500

$12.250

$12.000

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Distributors (In-Stock)

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Vyrian

USA . 8,524 parts In-Stock

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-

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8,524

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Bristol Electronics

USA . 7,000 parts In-Stock

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7,000

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Digiode

USA . 4,790 parts In-Stock

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4,790

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Chip Stock

USA . 143 parts In-Stock

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143

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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One Stop Electronics

USA . 531 parts In-Stock

1+ parts

$9.000

100+ parts

-

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531

$9.000

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AZTECH Wire

Italy . 441 parts In-Stock

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$19.801

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441

$19.801

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Ampacity Inc.

Singapore . 851 parts In-Stock

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$33.000

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851

$33.000

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Corohmni

South Africa . 82 parts In-Stock

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$33.074

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82

$33.074

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Microchip USA

USA . 202 parts In-Stock

1+ parts

$49.310

100+ parts

$48.880

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$48.880

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$48.450

202

$49.310

$48.880

$48.880

$48.450

Parana Technologies

USA . 607 parts In-Stock

1+ parts

$63.010

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607

$63.010

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DigiPath Technology Company

USA . 2,047 parts In-Stock

1+ parts

$69.382

100+ parts

$63.831

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2,047

$69.382

$63.831

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

1+ parts

$70.798

100+ parts

$67.258

1k+ parts

$63.718

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1,827

$70.798

$67.258

$63.718

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ChromeModa Solutions

Germany . 1,249 parts In-Stock

1+ parts

$70.798

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$58.054

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1,249

$70.798

$58.054

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Corphita

USA . 4,662 parts In-Stock

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4,662

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Netroflash

USA . 500 parts In-Stock

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500

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A-Z Elektronik GmbH

Germany . 162 parts In-Stock

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162

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Overview

Experience the innovation and reliability of Texas Instruments with the LM3S3739-IQC50-A0 microcontroller. Perfect for a wide range of applications, this powerful device offers high-quality performance and seamless connectivity. With integrated cache, low power mode, and numerous I/O lines, this microcontroller provides unmatched value and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the LM3S3739-IQC50-A0 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller easy to handle and suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves performance by storing frequently accessed data, reducing access times and enhancing overall efficiency.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller can efficiently operate within a safe power range, minimizing the risk of damage due to overvoltage.

Package Shape: SQUARE

The square package shape allows for easy mounting and alignment on PCBs, optimizing space utilization and facilitating a neater layout.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and energy efficiency, making this microcontroller suitable for demanding applications while conserving power.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32 MHz enables the microcontroller to execute instructions quickly, resulting in faster processing and response times.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various signal levels, enhancing the reliability and efficiency of the microcontroller.

Connectivity: I2C(2), SSI(2), UART(3), USB

The multiple connectivity options allow for versatile communication capabilities with other devices and systems, enhancing the microcontroller's flexibility and usability.

Low Power Mode: YES

The availability of a low power mode enables the microcontroller to conserve energy when not performing intensive tasks, extending battery life in portable applications.

Technical Specifications

Microcontrollers LM3S3739-IQC50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

61

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C(2), SSI(2), UART(3), USB

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S3739-IQC50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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