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LM3S3654-IQR50-C5

Texas Instruments

LM3S3654-IQR50-C5 by Texas Instruments

Texas Instruments LM3S3654-IQR50-C5 is a 32-bit Cortex-M3 microcontroller with 131072 ROM words and 49152 RAM bytes. It operates at up to 16.348 MHz, suitable for industrial applications requiring high-speed processing and low power consumption. With ADC and DMA channels, it offers versatile peripheral interfacing options for efficient data acquisition and transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,548 parts In-Stock

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6,548

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Digiode

USA . 3,784 parts In-Stock

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3,784

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Distributors (Availability)

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One Stop Electronics

USA . 1,633 parts In-Stock

1+ parts

$4.000

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1,633

$4.000

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AZTECH Wire

Italy . 315 parts In-Stock

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$7.590

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315

$7.590

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Parana Technologies

USA . 701 parts In-Stock

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$26.733

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$27.920

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701

$26.733

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$27.920

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DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$29.436

100+ parts

$27.081

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340

$29.436

$27.081

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IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$30.037

100+ parts

$28.535

1k+ parts

$27.033

10k+ parts

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1,206

$30.037

$28.535

$27.033

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ChromeModa Solutions

Germany . 440 parts In-Stock

1+ parts

$30.037

100+ parts

$24.630

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440

$30.037

$24.630

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Corphita

USA . 1,156 parts In-Stock

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Microchip USA

USA . 364 parts In-Stock

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Overview

Experience the power of innovation with the LM3S3654-IQR50-C5 microcontroller from Texas Instruments. Designed with precision and reliability in mind, this Cortex-M3 CPU family device offers unparalleled performance and efficiency for a wide range of applications. With advanced features like ADC and DMA channels, PWM channels, and a generous amount of RAM, this microcontroller provides the flexibility and functionality you need for your projects. Trust in Texas Instruments' reputation for quality and excellence to deliver cutting-edge technology that will take your designs to the next level. Elevate your work with the LM3S3654-IQR50-C5 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material, suitable for a wide range of applications.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.365 V

Efficient power management and operation within specified voltage range.

Package Shape: SQUARE

Compact shape that fits well in modern electronic designs.

Bit Size: 32

High-bit size ensures fast and efficient processing of data.

Power Supplies (V): 1.3,3.3

Compatible with standard power supplies, offering flexibility in design.

No. of Terminals: 64

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Variety of package styles for different mounting options and space constraints.

Minimum Supply Voltage: 1.235 V

Allows for efficient operation even at lower voltages.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

CPU Family: CORTEX-M3

High-performance CPU family known for its efficiency and reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures.

Terminal Finish: MATTE TIN

Provides a reliable and consistent finish for soldering connections.

ADC Channels: YES

Integrated analog-to-digital converter for precise sensor data processing.

DMA Channels: YES

Supports direct memory access for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for stable and secure connections.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design suitable for compact electronic devices.

Width: 10 mm

Compact width for space-efficient designs.

Maximum Clock Frequency: 16.348 MHz

High clock frequency for fast processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient solder reflow processes during assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures without damage.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control of peripherals.

RAM Bytes: 49152

Sufficient RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections.

Maximum Supply Current: 129 mA

Efficient power usage with low maximum supply current.

Nominal Supply Voltage: 1.3 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Support for pulse-width modulation for precise control of outputs.

ROM Programmability: FLASH

Flash ROM for easy and quick reprogramming of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and efficient connections.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage.

Speed: 50 rpm

Capable of handling processing tasks at a speed of 50 rotations per minute.

No. of I/O Lines: 33

Sufficient number of input/output lines for connecting peripherals and sensors.

Technical Specifications

Microcontrollers LM3S3654-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.348 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3654-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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