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LM3S328-IGZ25-C2T

Texas Instruments

LM3S328-IGZ25-C2T by Texas Instruments

LM3S328-IGZ25-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 0.032 MHz. It features 4096 bytes of RAM, 16384 ROM words, and ADC channels for industrial applications requiring high-speed processing and PWM control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,922 parts In-Stock

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Digiode

USA . 958 parts In-Stock

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AZTECH Wire

Italy . 337 parts In-Stock

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$7.373

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One Stop Electronics

USA . 1,453 parts In-Stock

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$12.000

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Parana Technologies

USA . 1,437 parts In-Stock

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$70.063

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ChromeModa Solutions

Germany . 5,529 parts In-Stock

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$78.723

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$64.553

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IDEA Electronic Components Group

UK . 391 parts In-Stock

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$78.723

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$74.787

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$70.851

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Corphita

USA . 4,133 parts In-Stock

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DigiPath Technology Company

USA . 2,164 parts In-Stock

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Microchip USA

USA . 1,720 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S328-IGZ25-C2T microcontroller from Texas Instruments. This high-quality device offers unmatched performance and reliability, making it perfect for a wide range of applications. With advanced features and a sleek design, this microcontroller is sure to meet all your needs. Upgrade your projects today and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package makes it easier to integrate this microcontroller into a circuit board, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in the power source for the microcontroller.

Package Shape: SQUARE

Square package shape helps in optimizing the layout and placement of the microcontroller on a circuit board, making it easier to design around.

Bit Size: 32

32-bit architecture enables faster processing and more memory addressing capability compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 3.3

Standard power supply voltage simplifies the design process and compatibility with other components in the system.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and versatility in interfacing with external devices.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good thermal performance and protection for the microcontroller, ensuring reliability in operation.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this microcontroller can operate in a wide range of power conditions, improving flexibility in system design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes this microcontroller suitable for industrial applications where temperature variations can occur.

Minimum Operating Temperature: -40 °C

Wide temperature range allows this microcontroller to be used in harsh environments with extreme cold conditions.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals for input processing.

Terminal Position: QUAD

Quad terminal position offers convenient placement and soldering options, making it easier to integrate into a circuit board design.

ROM Words: 16384

Large ROM capacity allows for storing more program instructions and data, enabling complex applications to run efficiently.

Maximum Seated Height: 1 mm

Low seated height makes this microcontroller suitable for compact designs where space constraints are a concern.

Width: 6.875 mm

Narrow width dimension helps in conserving space on a circuit board layout, contributing to better overall system integration.

Maximum Clock Frequency: 0.032 MHz

High clock frequency capability allows for fast operation and execution of instructions, enhancing the performance of the microcontroller.

Length: 6.875 mm

Short length dimension further aids in compact system design, saving space and allowing for efficient use of board real estate.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and robustness in harsh operating environments where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller provides efficient processing performance and streamlined execution of instructions, making it suitable for real-time applications.

RAM Bytes: 4096

Adequate RAM capacity allows for storage and manipulation of data during program execution, facilitating smooth operation of diverse applications.

Technology: CMOS

Complementary metal-oxide-semiconductor technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process and reduces the risk of soldering defects, ensuring a secure and reliable electrical connection.

Maximum Supply Current: 65 mA

Low maximum supply current requirement helps in reducing power consumption and heat dissipation, contributing to energy efficiency and system longevity.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with other components in the system, preventing voltage-related issues.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital output signals for applications such as motor control, lighting systems, and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming of the microcontroller, enabling firmware updates and customization without the need for external programming hardware.

Terminal Pitch: 0.5 mm

Fine terminal pitch offers high-density mounting options and precise alignment in circuit board assembly, enhancing the overall reliability and performance of the system.

Speed: 25 rpm

With a speed of 25 rpm, this microcontroller can process instructions and data at a rapid pace, meeting the demands of real-time and high-speed applications.

No. of I/O Lines: 28

Having a sufficient number of input/output lines allows for versatile connectivity and flexibility in interfacing with external devices and peripherals, enhancing the usability of the microcontroller.

Technical Specifications

Microcontrollers LM3S328-IGZ25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S328-IGZ25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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