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LM3S328-EQN25-C2

Texas Instruments

LM3S328-EQN25-C2 by Texas Instruments

LM3S328-EQN25-C2 by Texas Instruments is a 32-bit microcontroller with 8KB RAM, 16KB ROM, and 8 ADC channels. Ideal for industrial applications, it operates at -40 to 105°C with a max clock frequency of 0.032 MHz. Featuring low power mode and connectivity options like I2C and UART, it's suitable for various embedded systems.

Median Price

$6.912

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 121 parts In-Stock

1+ parts

-

100+ parts

$5.530

1k+ parts

$4.950

10k+ parts

$4.660

121

-

$5.530

$4.950

$4.660

DigiKey

USA . 121 parts In-Stock

1+ parts

-

100+ parts

$7.280

1k+ parts

-

10k+ parts

-

121

-

$7.280

-

-

Verical

USA . 121 parts In-Stock

1+ parts

-

100+ parts

$6.912

1k+ parts

$6.188

10k+ parts

$5.825

121

-

$6.912

$6.188

$5.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 998 parts In-Stock

1+ parts

$5.833

100+ parts

-

1k+ parts

-

10k+ parts

-

998

$5.833

-

-

-

Vyrian

USA . 8,345 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

8,345

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,969 parts In-Stock

1+ parts

$5.526

100+ parts

-

1k+ parts

-

10k+ parts

-

1,969

$5.526

-

-

-

Parana Technologies

USA . 2,092 parts In-Stock

1+ parts

$27.199

100+ parts

-

1k+ parts

$33.213

10k+ parts

-

2,092

$27.199

-

$33.213

-

ChromeModa Solutions

Germany . 5,351 parts In-Stock

1+ parts

$30.561

100+ parts

$25.060

1k+ parts

-

10k+ parts

-

5,351

$30.561

$25.060

-

-

IDEA Electronic Components Group

UK . 2,230 parts In-Stock

1+ parts

$30.561

100+ parts

$29.033

1k+ parts

$27.505

10k+ parts

-

2,230

$30.561

$29.033

$27.505

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,000

-

-

-

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DigiPath Technology Company

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

$27.554

1k+ parts

-

10k+ parts

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1,192

-

$27.554

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-

Microchip USA

USA . 337 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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337

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Overview

Unlock endless possibilities with the LM3S328-EQN25-C2 microcontroller by Texas Instruments. Crafted with precision and expertise, this powerful device offers unparalleled performance for a wide range of applications. From industrial automation to IoT devices, this versatile microcontroller delivers seamless connectivity, low power consumption, and advanced features like integrated cache and ADC channels. Experience reliability and innovation at its finest with the LM3S328-EQN25-C2 - your gateway to cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache helps improve the performance by storing frequently used data for quick access.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

On Chip Data RAM Width: 8

With a wider data RAM width, the microcontroller can handle larger amounts of data efficiently.

Package Shape: SQUARE

The square shape of the package allows for easy placement on circuit boards and efficient use of space.

Bit Size: 32

A larger bit size allows for more complex operations and calculations to be performed by the microcontroller.

Power Supplies (V): 3.3

The standard 3.3V power supply is commonly used in electronic devices, making this microcontroller compatible with many applications.

No. of Terminals: 48

Having a higher number of terminals allows for more connections and interfaces, increasing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile design, making it suitable for compact electronic devices.

Technical Specifications

Microcontrollers LM3S328-EQN25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

28

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S328-EQN25-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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