Loading...

LM3S317-IGZ25-C2

Texas Instruments

LM3S317-IGZ25-C2 by Texas Instruments

LM3S317-IGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 25 MHz. It features 4096 bytes of RAM, 16384 ROM words, and ADC channels for industrial applications requiring a max supply voltage of 3.6 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,620

-

-

-

-

Digiode

USA . 1,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,464

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$4.886

100+ parts

-

1k+ parts

-

10k+ parts

-

767

$4.886

-

-

-

One Stop Electronics

USA . 548 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

-

10k+ parts

-

548

$11.000

-

-

-

Parana Technologies

USA . 1,330 parts In-Stock

1+ parts

$55.569

100+ parts

-

1k+ parts

-

10k+ parts

-

1,330

$55.569

-

-

-

DigiPath Technology Company

USA . 1,010 parts In-Stock

1+ parts

$61.188

100+ parts

$56.293

1k+ parts

-

10k+ parts

-

1,010

$61.188

$56.293

-

-

ChromeModa Solutions

Germany . 1,851 parts In-Stock

1+ parts

$62.437

100+ parts

$51.198

1k+ parts

-

10k+ parts

-

1,851

$62.437

$51.198

-

-

IDEA Electronic Components Group

UK . 826 parts In-Stock

1+ parts

$62.437

100+ parts

$59.315

1k+ parts

$56.193

10k+ parts

-

826

$62.437

$59.315

$56.193

-

Microchip USA

USA . 1,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

-

-

-

-

Corphita

USA . 352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

352

-

-

-

-

Overview

Unlock the power of innovation with the LM3S317-IGZ25-C2 microcontroller by Texas Instruments. Known for their cutting-edge technology and reliability, Texas Instruments delivers unmatched quality in the world of microcontrollers. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its advanced features and performance capabilities. Experience seamless operation and enhanced functionality with the LM3S317-IGZ25-C2, setting new standards in the industry. Elevate your projects to new heights with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a wide range of allowable input voltage, making it versatile for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Bit Size: 32

High bit size allows for more complex operations and calculations to be performed.

Power Supplies (V): 3.3

Stable power supply voltage ensures reliable operation of the microcontroller.

No. of Terminals: 48

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in terms of thermal management and space constraints.

Minimum Supply Voltage: 3 V

Ensures that the microcontroller can operate within a safe voltage range.

Maximum Operating Temperature: 85 °C

Can operate reliably in industrial environments with high temperatures.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in various environments.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position simplifies the connection of external components.

ROM Words: 16384

Large ROM capacity allows for storing program instructions and data.

Maximum Seated Height: 1 mm

Low seated height is beneficial for compact designs and space-saving on the circuit board.

Width: 6.875 mm

Compact width enables the microcontroller to fit in tight spaces and small form factor devices.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing and execution of instructions.

Length: 6.875 mm

Compact length complements the width for a small overall footprint.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and fast instruction execution for improved performance.

RAM Bytes: 4096

Adequate RAM capacity for storing and manipulating data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process during assembly.

Maximum Supply Current: 65 mA

Low supply current consumption helps in energy efficiency and prolonged battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable operation.

PWM Channels: YES

Pulse width modulation channels allow for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the stored program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board.

Speed: 25 rpm

High speed capability for processing data and executing instructions efficiently.

No. of I/O Lines: 30

Sufficient number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S317-IGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S317-IGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20