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LM3S317-EQN25-C2T

Texas Instruments

LM3S317-EQN25-C2T by Texas Instruments

Texas Instruments' LM3S317-EQN25-C2T is a 32-bit microcontroller with 16384 ROM words, 4096 RAM bytes, and 30 I/O lines. Operating at up to 25 MHz with a supply voltage of 3.3 V, it's ideal for industrial applications requiring PWM channels and ADC functionality. The compact square package measures 7mm x 7mm with a low profile of only 1.6 mm, making it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,790 parts In-Stock

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6,790

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Digiode

USA . 4,255 parts In-Stock

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4,255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,260 parts In-Stock

1+ parts

$7.000

100+ parts

-

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1,260

$7.000

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AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$10.871

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773

$10.871

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Parana Technologies

USA . 1,382 parts In-Stock

1+ parts

$38.402

100+ parts

$3,566.182

1k+ parts

$34.562

10k+ parts

-

1,382

$38.402

$3,566.182

$34.562

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DigiPath Technology Company

USA . 588 parts In-Stock

1+ parts

$42.285

100+ parts

-

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588

$42.285

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ChromeModa Solutions

Germany . 4,823 parts In-Stock

1+ parts

$43.148

100+ parts

$35.381

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4,823

$43.148

$35.381

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IDEA Electronic Components Group

UK . 1,133 parts In-Stock

1+ parts

$43.148

100+ parts

$40.991

1k+ parts

$38.833

10k+ parts

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1,133

$43.148

$40.991

$38.833

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Corphita

USA . 4,236 parts In-Stock

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4,236

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Microchip USA

USA . 293 parts In-Stock

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293

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Overview

Discover the LM3S317-EQN25-C2T by Texas Instruments, a top-notch microcontroller designed to deliver exceptional performance and reliability. With a 32-bit architecture and advanced CMOS technology, this microcontroller is perfect for a wide range of applications in industrial settings. Benefit from its low power consumption, high clock frequency, and extensive I/O capabilities for seamless integration into your projects. Trust in Texas Instruments' reputation for quality and innovation, and unlock endless possibilities with the LM3S317-EQN25-C2T. Elevate your designs and exceed expectations with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle higher power requirements without risk of damage.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it easy to fit into tight spaces on a PCB.

Bit Size: 32

32-bit architecture enables higher computational power and performance, suitable for a wide range of applications.

RAM Bytes: 4096

With 4096 bytes of RAM, this microcontroller can handle complex tasks and data processing efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the peripheral IC type ensures optimized performance and power efficiency in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller reliable and energy-efficient.

Technical Specifications

Microcontrollers LM3S317-EQN25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S317-EQN25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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