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LM3S316-IQN25-C2T

Texas Instruments

LM3S316-IQN25-C2T by Texas Instruments

Texas Instruments' LM3S316-IQN25-C2T is a 32-bit microcontroller with 16384 ROM words, 4096 RAM bytes, and 32 I/O lines. It operates at a max clock frequency of 8.192 MHz and has PWM channels for industrial applications requiring precise control and monitoring within the temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,176 parts In-Stock

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Digiode

USA . 714 parts In-Stock

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One Stop Electronics

USA . 640 parts In-Stock

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$10.000

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640

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AZTECH Wire

Italy . 589 parts In-Stock

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$16.455

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Parana Technologies

USA . 1,574 parts In-Stock

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$62.251

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IDEA Electronic Components Group

UK . 1,823 parts In-Stock

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$69.945

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$66.448

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$62.950

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1,823

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ChromeModa Solutions

Germany . 1,591 parts In-Stock

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$69.945

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$57.355

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Corphita

USA . 4,548 parts In-Stock

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DigiPath Technology Company

USA . 1,907 parts In-Stock

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Microchip USA

USA . 1,447 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the LM3S316-IQN25-C2T microcontroller. This powerful device is perfect for a wide range of applications, offering customers exceptional value and benefits. With advanced technology and innovative features, this microcontroller provides efficient performance and seamless operation. Trust Texas Instruments to deliver top-notch products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for a variety of environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle higher power requirements without risk of damage.

Package Shape: SQUARE

The square package shape provides a compact design that saves space on circuit boards, ideal for devices with limited real estate.

Bit Size: 32

Having a 32-bit architecture allows for faster processing and greater memory capabilities, making it suitable for complex applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent performance and reliable operation of the microcontroller.

No. of Terminals: 48

The abundant number of terminals allows for connectivity to a wide range of peripherals and interfaces, enhancing versatility and functionality.

ADC Channels: YES

Having Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency of 8.192 MHz provides fast processing speeds for time-critical applications, ensuring efficient operation.

ROM Words: 16384

Ample ROM words provide sufficient storage for program instructions and data, accommodating complex algorithms and applications.

RAM Bytes: 4096

Generous RAM capacity of 4096 bytes allows for temporary storage of data and variables during program execution, enhancing computational efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog outputs, suitable for applications requiring variable speed or brightness control.

Technical Specifications

Microcontrollers LM3S316-IQN25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S316-IQN25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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