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LM3S316-IGZ25-C2

Texas Instruments

LM3S316-IGZ25-C2 by Texas Instruments

LM3S316-IGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 8.192 MHz. It features 4096 bytes of RAM, 16384 ROM words, and supports ADC and PWM channels. Ideal for industrial applications requiring a compact chip carrier package with a low profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,774 parts In-Stock

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7,774

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Digiode

USA . 52 parts In-Stock

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52

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One Stop Electronics

USA . 623 parts In-Stock

1+ parts

$1.000

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623

$1.000

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AZTECH Wire

Italy . 663 parts In-Stock

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$5.573

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663

$5.573

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Parana Technologies

USA . 1,445 parts In-Stock

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$43.225

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1,445

$43.225

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ChromeModa Solutions

Germany . 2,326 parts In-Stock

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$48.567

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$39.825

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2,326

$48.567

$39.825

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IDEA Electronic Components Group

UK . 1,842 parts In-Stock

1+ parts

$48.567

100+ parts

$46.139

1k+ parts

$43.710

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1,842

$48.567

$46.139

$43.710

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Corphita

USA . 4,461 parts In-Stock

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4,461

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Microchip USA

USA . 2,502 parts In-Stock

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DigiPath Technology Company

USA . 1,393 parts In-Stock

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$43.788

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$43.788

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Overview

Unlock a world of endless possibilities with the LM3S316-IGZ25-C2 by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative product delivers exceptional performance and efficiency. Experience seamless integration and enhanced functionality with this cutting-edge technology. Elevate your projects to new heights with the LM3S316-IGZ25-C2, where value meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient mounting on a PCB, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Allows for a wide operating voltage range, making the microcontroller versatile and compatible with different power supply setups.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB, allowing for a compact design.

Bit Size: 32

A 32-bit architecture allows for complex calculations and data processing, making the microcontroller suitable for advanced applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation of the microcontroller.

No. of Terminals: 48

Having 48 terminals provides plenty of I/O options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers flexibility in mounting options and thermal management, making the microcontroller versatile in different environments.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures stable operation even at low power situations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function reliably even in harsh cold environments.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, widening the range of applications.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and assembly, making the integration of the microcontroller easier.

ROM Words: 16384

With 16,384 ROM words, the microcontroller can store a significant amount of program instructions, enabling complex functionalities.

Maximum Seated Height: 1 mm

The low profile of 1mm allows for compact designs and saves space on the PCB.

Width: 6.875 mm

Narrow width of 6.875mm allows for efficient space utilization and compact PCB design.

Maximum Clock Frequency: 8.192 MHz

High clock frequency of 8.192MHz enables fast data processing and real-time operation of the microcontroller.

Length: 6.875 mm

Short length of 6.875mm contributes to a compact form factor of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on RISC architecture, the microcontroller offers high performance and efficiency in executing instructions.

RAM Bytes: 4096

With 4,096 RAM bytes, the microcontroller can efficiently handle data processing and temporary storage requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process during assembly, improving manufacturing efficiency.

Maximum Supply Current: 65 mA

Low supply current of 65mA reduces power consumption, making the microcontroller suitable for battery-operated devices.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V ensures consistent and stable operation of the microcontroller in various operating conditions.

PWM Channels: YES

Pulse width modulation channels enable precise control of analog components such as motors and LEDs, expanding the range of applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling compact designs.

Speed: 25 rpm

Operational speed of 25rpm allows for fast data processing and response time, suitable for real-time control applications.

No. of I/O Lines: 32

Having 32 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile.

Technical Specifications

Microcontrollers LM3S316-IGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S316-IGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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