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LM3S315-IGZ25-C2T

Texas Instruments

LM3S315-IGZ25-C2T by Texas Instruments

LM3S315-IGZ25-C2T by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 16384 ROM words, and 4096 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 85°C, features 32 I/O lines, and supports up to 25 MHz clock frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,370 parts In-Stock

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Digiode

USA . 3,104 parts In-Stock

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One Stop Electronics

USA . 984 parts In-Stock

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$13.000

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984

$13.000

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AZTECH Wire

Italy . 196 parts In-Stock

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$18.947

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Parana Technologies

USA . 1,532 parts In-Stock

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$51.573

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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$56.788

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$56.788

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ChromeModa Solutions

Germany . 1,402 parts In-Stock

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$57.947

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$47.517

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$57.947

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IDEA Electronic Components Group

UK . 506 parts In-Stock

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$57.947

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$55.050

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$52.152

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506

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QUARKTWIN TECHNOLOGY LTD

USA . 27,868 parts In-Stock

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Microchip USA

USA . 4,292 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the Texas Instruments LM3S315-IGZ25-C2T microcontroller. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in a compact square package. Perfect for a wide range of applications, this microcontroller offers customers unmatched value and benefits. With its 32-bit size, 25 MHz clock frequency, and 4096 RAM bytes, the LM3S315-IGZ25-C2T provides seamless performance for all your industrial needs. Experience the advantage of superior technology with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller convenient for mass production.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of applications and power sources.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, ideal for compact designs.

Bit Size: 32

32-bit architecture provides enhanced computing power and performance for more complex tasks.

Power Supplies (V): 3.3

Stable power supply voltage of 3.3V ensures reliable operation and compatibility with common power sources.

No. of Terminals: 48

Ample number of terminals allow for versatile connectivity options and interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and thermal management, catering to different application requirements.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable operation even in extreme cold environments.

ADC Channels: YES

Built-in ADC channels enable analog input processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, enhancing design efficiency and ease of assembly.

ROM Words: 16384

Large ROM capacity of 16384 words allows for storing complex program code and data, catering to diverse application requirements.

Maximum Seated Height: 1 mm

Low maximum seated height enables slim and compact designs, ideal for space-constrained applications.

Width: 6.875 mm

Narrow width of 6.875mm facilitates compact PCB design, suitable for applications with limited space.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25MHz allows for fast processing speed and real-time operation, enhancing overall performance.

Length: 6.875 mm

Compact length of 6.875mm complements the narrow width, contributing to a space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers efficient and fast data processing capabilities, suitable for a wide range of applications.

RAM Bytes: 4096

Ample RAM capacity of 4096 bytes allows for data storage and manipulation, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various power supplies, enhancing overall reliability and efficiency.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and offers better soldering properties, contributing to a more sustainable and reliable design.

Maximum Supply Current: 65 mA

Moderate maximum supply current consumption of 65mA ensures energy efficiency and prolonged battery life in portable applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation across various environmental conditions and power sources.

PWM Channels: YES

Built-in PWM channels allow for precise control of analog signals, enabling modulation and control of various actuators and components.

ROM Programmability: FLASH

Flash ROM programmability offers the flexibility to update and modify program code easily, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layout and miniaturization, suitable for compact and portable device designs.

Speed: 25 rpm

Operating speed of 25rpm ensures fast data processing and response time, suitable for real-time control and monitoring applications.

No. of I/O Lines: 32

Ample number of I/O lines provide flexibility for connectivity and peripheral interfacing, accommodating various input and output devices.

Technical Specifications

Microcontrollers LM3S315-IGZ25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S315-IGZ25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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