Loading...

LM3S310-EQN25-C2T

Texas Instruments

LM3S310-EQN25-C2T by Texas Instruments

LM3S310-EQN25-C2T by Texas Instruments is a 32-bit microcontroller with 16384 ROM words and 4096 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it is ideal for industrial applications requiring PWM channels and ADC functionality. With a package style of FLATPACK and GULL WING terminal form, this CMOS technology device offers 36 I/O lines for versatile connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,116

-

-

-

-

Digiode

USA . 3,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,053

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 814 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$10.000

-

-

-

AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$18.890

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$18.890

-

-

-

Parana Technologies

USA . 471 parts In-Stock

1+ parts

$28.247

100+ parts

-

1k+ parts

$45.377

10k+ parts

-

471

$28.247

-

$45.377

-

DigiPath Technology Company

USA . 459 parts In-Stock

1+ parts

$31.103

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$31.103

-

-

-

ChromeModa Solutions

Germany . 6,974 parts In-Stock

1+ parts

$31.738

100+ parts

$26.025

1k+ parts

-

10k+ parts

-

6,974

$31.738

$26.025

-

-

IDEA Electronic Components Group

UK . 1,422 parts In-Stock

1+ parts

$31.738

100+ parts

$30.151

1k+ parts

$28.564

10k+ parts

-

1,422

$31.738

$30.151

$28.564

-

Corphita

USA . 3,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,257

-

-

-

-

Microchip USA

USA . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

Overview

Unlock the power of innovation with the LM3S310-EQN25-C2T by Texas Instruments, a cutting-edge microcontroller that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this microcontroller is designed for a wide range of applications, offering customers exceptional value and benefits. Whether you're developing IoT devices, robotics, or industrial automation systems, this product's advanced features and high-quality construction ensure optimal performance. Trust Texas Instruments to provide you with the tools you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V allows for compatibility with a wide range of power sources, increasing the versatility of the microcontroller.

Package Shape: SQUARE

The square package shape is efficient for PCB layout and design, optimizing space utilization and enabling compact electronic devices.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and processes, providing high performance and efficiency for demanding applications.

Power Supplies (V): 3.3

The 3.3 V power supply ensures stable and reliable operation of the microcontroller, meeting industry-standard voltage requirements.

No. of Terminals: 48

The 48 terminals offer ample connectivity options for interfacing with external devices and peripherals, allowing for versatile input/output configurations.

Package Style (Meter): FLATPACK

The flatpack package style facilitates heat dissipation and enhances thermal performance, ensuring the microcontroller operates efficiently even under high temperatures.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources while maintaining energy efficiency for battery-powered applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microcontroller can withstand harsh environmental conditions and industrial applications without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microcontroller to function in cold environments or extreme temperature variations, expanding its usability across different conditions.

ADC Channels: YES

The analog-to-digital converter (ADC) channels enable the microcontroller to process analog signals, making it suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

The quad terminal position enhances the microcontroller's connectivity options and allows for efficient routing of signals, enabling flexible circuit board layout designs.

ROM Words: 16384

With 16,384 ROM words, the microcontroller has ample memory capacity for storing program instructions and data, supporting complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm minimizes the vertical profile of the microcontroller, making it suitable for slim and compact device designs.

Width: 7 mm

The compact width of 7 mm allows for efficient use of space on the circuit board, enabling the integration of the microcontroller into small form factor electronic devices.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32 MHz enables fast processing and execution of instructions, resulting in quick response times and high-speed performance.

Length: 7 mm

The short length of 7 mm contributes to space-saving designs and compact electronic devices, particularly beneficial in applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microcontroller can operate reliably in harsh industrial environments, providing robust performance and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

With a RISC-based microcontroller architecture, the product offers efficient data processing and low power consumption, ideal for applications requiring high performance and energy efficiency.

RAM Bytes: 4096

The 4,096 bytes of RAM provide sufficient memory for data storage and processing, supporting multitasking and memory-intensive applications with ease.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high noise immunity, and compatibility with a wide range of digital circuits, making it a versatile choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and mounting of the microcontroller onto the circuit board, enhancing ease of assembly and reliability of connections.

Maximum Supply Current: 65 mA

With a maximum supply current of 65 mA, the microcontroller operates efficiently while consuming low power, making it suitable for battery-powered devices and energy-conscious applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures stable and consistent power delivery to the microcontroller, maintaining reliable operation and performance across varying load conditions.

PWM Channels: YES

The pulse width modulation (PWM) channels enable precise control of analog signals, making the microcontroller suitable for motor control, power regulation, and dimming applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick reprogramming of the microcontroller's memory, facilitating firmware updates and customization as needed for specific applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enhances the microcontroller's layout flexibility and compatibility with densely populated circuit boards, enabling compact and space-efficient designs.

Speed: 25 rpm

With a speed rating of 25 rpm, the microcontroller can process instructions and data at a high rate, ensuring rapid execution of tasks and efficient operation in time-critical applications.

No. of I/O Lines: 36

The 36 I/O lines provide ample input and output options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility and connectivity capabilities.

Technical Specifications

Microcontrollers LM3S310-EQN25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S310-EQN25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20