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LM3S308-IGZ25-C2

Texas Instruments

LM3S308-IGZ25-C2 by Texas Instruments

LM3S308-IGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 25MHz clock frequency, and 4096 bytes of RAM. Ideal for industrial applications requiring high-speed processing, it features ADC and PWM channels for precise control in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,762 parts In-Stock

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Digiode

USA . 2,036 parts In-Stock

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AZTECH Wire

Italy . 847 parts In-Stock

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$10.343

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One Stop Electronics

USA . 655 parts In-Stock

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$17.000

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Parana Technologies

USA . 2,128 parts In-Stock

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$18.573

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$18.675

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$20.451

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$18.815

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ChromeModa Solutions

Germany . 4,821 parts In-Stock

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$20.868

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$17.112

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IDEA Electronic Components Group

UK . 881 parts In-Stock

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$20.868

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$19.825

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$18.781

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QUARKTWIN TECHNOLOGY LTD

USA . 26,141 parts In-Stock

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Microchip USA

USA . 4,025 parts In-Stock

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Corphita

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Metaverse IC Inc.

Canada . 1,082 parts In-Stock

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Kepictronics

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Overview

Elevate your projects with the LM3S308-IGZ25-C2 by Texas Instruments, a top-tier microcontroller that promises superior performance and reliability. Crafted by the renowned manufacturer Texas Instruments, this microcontroller is designed to exceed expectations in various applications. With advanced features such as ADC channels, PWM channels, and a maximum clock frequency of 25 MHz, this product offers unparalleled value and benefits. Say goodbye to technical limitations and embrace limitless possibilities with the LM3S308-IGZ25-C2 – the ultimate choice for all your microcontroller needs.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a PCB, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the device within a safe voltage range.

Package Shape: SQUARE

Easily fits into compact designs and allows for efficient use of space on the PCB.

Bit Size: 32

Offers sufficient processing power for various microcontroller applications.

Power Supplies (V): 3.3

Operates within a common supply voltage range, making it compatible with many systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers options for thermal management and space-saving profiles, enhancing the overall performance of the device.

Minimum Supply Voltage: 3 V

Ensures stable operation at a low voltage, suitable for many applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, adding to its versatility in various environments.

ADC Channels: YES

Enables analog-to-digital conversion, enhancing the device's ability to interface with analog sensors.

Terminal Position: QUAD

Facilitates easy PCB layout and connection of external components to the microcontroller.

ROM Words: 16384

Provides ample memory for storing program instructions and data.

Maximum Seated Height: 1 mm

Low profile design allows for compact and slim device designs.

Width: 6.875 mm

Compact width enables efficient use of PCB space and component placement.

Maximum Clock Frequency: 25 MHz

Allows for high-speed processing and execution of instructions.

Length: 6.875 mm

Compact length contributes to efficient space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and control of peripheral devices.

RAM Bytes: 4096

Offers sufficient random access memory for data storage and manipulation during operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable operation.

Terminal Form: NO LEAD

Enables easy and reliable soldering on the PCB without traditional leads.

Maximum Supply Current: 65 mA

Operates within a low current range, suitable for many battery-powered applications.

Nominal Supply Voltage: 3.3 V

Maintains stable operation at a commonly used supply voltage.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

ROM Programmability: FLASH

Offers reprogrammable flash memory for easy updates and modifications to the program.

Terminal Pitch: 0.5 mm

Provides fine pitch terminals for compact PCB layout and high-density interconnections.

Speed: 25 rpm

Operates at a high speed for efficient processing and execution of tasks.

No. of I/O Lines: 28

Provides adequate input/output lines for connecting to external devices and expanding functionality.

Technical Specifications

Microcontrollers LM3S308-IGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S308-IGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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