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LM3S301-EGZ20-C2T

Texas Instruments

LM3S301-EGZ20-C2T by Texas Instruments

LM3S301-EGZ20-C2T by Texas Instruments is a 32-bit microcontroller with 16384 ROM words, 2048 RAM bytes, and 33 I/O lines. It operates at a max clock frequency of 20 MHz and has PWM channels for industrial applications requiring high-speed processing within the temperature range of -40 to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,288 parts In-Stock

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Digiode

USA . 3,043 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 681 parts In-Stock

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$9.000

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681

$9.000

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AZTECH Wire

Italy . 683 parts In-Stock

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$14.770

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Parana Technologies

USA . 2,089 parts In-Stock

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$47.223

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DigiPath Technology Company

USA . 1,543 parts In-Stock

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$51.999

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ChromeModa Solutions

Germany . 2,325 parts In-Stock

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$53.060

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$43.509

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$53.060

$43.509

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

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$53.060

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$50.407

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$47.754

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1,411

$53.060

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$47.754

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Corphita

USA . 2,413 parts In-Stock

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Microchip USA

USA . 1,191 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S301-EGZ20-C2T by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. With advanced features and reliable performance, this product offers exceptional value to customers looking for cutting-edge technology. Explore new possibilities and elevate your projects with the LM3S301-EGZ20-C2T today.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCB, saves space and reduces production cost.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Bit Size: 32

High bit size allows for processing and storing larger amounts of data.

Power Supplies (V): 3.3

Standard power supply voltage, widely compatible with other components.

No. of Terminals: 48

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles allow for different mounting and cooling options.

Minimum Supply Voltage: 3 V

Can operate at lower voltages, saving power and extending battery life.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold environments.

ADC Channels: YES

Ability to convert analog signals to digital, enabling versatile sensor interfaces.

Terminal Position: QUAD

Quad terminal position provides stable connections and efficient layout on PCB.

ROM Words: 16384

Large ROM capacity allows for storing extensive program code.

Maximum Seated Height: 1 mm

Low profile design saves space in compact electronic devices.

Width: 6.875 mm

Compact width allows for efficient placement on a circuit board.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing of instructions.

Length: 6.875 mm

Compact length contributes to overall space-saving design.

Temperature Grade: INDUSTRIAL

Designed to operate in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution for embedded applications.

RAM Bytes: 2048

Adequate RAM for storing variables and temporary data during program execution.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and industry standards.

Maximum Supply Current: 50 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for reliable performance of the microcontroller.

PWM Channels: YES

PWM channels allow for precise control of motor speed and other applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the memory without the need for external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs.

Speed: 20 rpm

Operates at a speed of 20 rotations per minute for specific applications.

No. of I/O Lines: 33

Sufficient number of I/O lines for connecting peripherals and external devices.

Technical Specifications

Microcontrollers LM3S301-EGZ20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

33

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S301-EGZ20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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