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LM3S300-EGZ25-C2T

Texas Instruments

LM3S300-EGZ25-C2T by Texas Instruments

LM3S300-EGZ25-C2T by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 4096 bytes of RAM, and a max clock frequency of 25 MHz. Ideal for industrial applications, it features flash ROM programmability, PWM channels, and ADC capabilities. With a compact square package style and low power consumption at 65 mA max supply current, it suits various embedded system designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,974 parts In-Stock

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Digiode

USA . 1,669 parts In-Stock

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1,669

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Distributors (Availability)

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AZTECH Wire

Italy . 843 parts In-Stock

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$17.566

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$17.566

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One Stop Electronics

USA . 1,611 parts In-Stock

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$25.000

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Parana Technologies

USA . 467 parts In-Stock

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$42.501

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467

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ChromeModa Solutions

Germany . 2,828 parts In-Stock

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$47.754

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$39.158

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2,828

$47.754

$39.158

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IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$47.754

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$45.366

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$42.979

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1,784

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$45.366

$42.979

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Microchip USA

USA . 1,332 parts In-Stock

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Corphita

USA . 658 parts In-Stock

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DigiPath Technology Company

USA . 337 parts In-Stock

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$43.055

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Overview

Unlock the power of innovation with the Texas Instruments LM3S300-EGZ25-C2T microcontroller. Boasting top-notch quality from a trusted manufacturer, this microcontroller offers unparalleled value and benefits for a wide range of applications. With its advanced features and cutting-edge technology, this chip is designed to exceed your expectations. Whether you're working on industrial automation, robotics, or IoT projects, this microcontroller is the ultimate solution to help you bring your ideas to life. Embrace the future of technology with the LM3S300-EGZ25-C2T and witness the endless possibilities it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation onto printed circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within the specified voltage range.

Package Shape: SQUARE

Square package shape offers efficient use of space on the PCB, enabling compact and streamlined designs.

Bit Size: 32

32-bit architecture allows for faster and more complex processing capabilities, suitable for a wide range of applications.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with common power sources and simplifies system integration.

No. of Terminals: 48

Sufficient number of terminals for connecting peripherals and external components, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in thermal management and integration options, catering to different design requirements.

Minimum Supply Voltage: 3 V

Wide operating voltage range allows for reliable performance even in fluctuating or lower voltage conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures the microcontroller can withstand harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold environments, increasing the product's utility in various applications.

ADC Channels: YES

Built-in analog-to-digital converters simplify interfacing with analog sensors and signals, expanding the microcontroller's capabilities.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout and soldering, improving assembly efficiency.

ROM Words: 16384

Large ROM capacity allows for storing extensive program code and data, enabling the microcontroller to handle complex tasks.

Maximum Seated Height: 1 mm

Low profile design minimizes the space taken up on the PCB, ideal for compact and slim devices.

Width: 6.875 mm

Compact width dimension enables space-efficient PCB layout, contributing to overall system miniaturization.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing speeds, suitable for demanding real-time applications.

Length: 6.875 mm

Small length dimension helps in designing compact and portable electronic devices without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller offers efficient processing capabilities with reduced instruction set complexity, enhancing performance.

RAM Bytes: 4096

Adequate RAM capacity for temporary data storage and manipulation tasks, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, extending battery life and ensuring reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of lead contamination during manufacturing and disposal.

Maximum Supply Current: 65 mA

Efficient power management with low supply current requirement, contributing to energy efficiency and extended battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of analog outputs, enhancing the microcontroller's capability for motor control and lighting applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and applications without requiring specialized programming equipment.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting of components on the PCB, optimizing space usage and enabling compact designs.

Speed: 25 rpm

High processing speed of 25 rpm supports real-time data processing and fast response times in time-critical applications.

No. of I/O Lines: 36

Sufficient number of input/output lines for connecting peripherals, sensors, and external devices, enabling versatile functionality and interfacing options.

Technical Specifications

Microcontrollers LM3S300-EGZ25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S300-EGZ25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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