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LM3S2U93-IQC80-A2T

Texas Instruments

LM3S2U93-IQC80-A2T by Texas Instruments

Texas Instruments LM3S2U93-IQC80-A2T microcontroller features 32-bit Cortex-M3 CPU, 16-Ch 12-Bit ADC, and 8 PWM channels. Ideal for industrial applications with -40 to 85°C operating temp range, it offers CAN, I2C, SPI connectivity options in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,505 parts In-Stock

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Digiode

USA . 2,095 parts In-Stock

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One Stop Electronics

USA . 1,000 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 612 parts In-Stock

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$6.438

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612

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Parana Technologies

USA . 1,883 parts In-Stock

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$28.407

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$47.134

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$28.407

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DigiPath Technology Company

USA . 887 parts In-Stock

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$31.280

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$28.777

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887

$31.280

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ChromeModa Solutions

Germany . 4,408 parts In-Stock

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$31.918

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$26.173

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$31.918

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IDEA Electronic Components Group

UK . 325 parts In-Stock

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$31.918

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$30.322

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$28.726

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325

$31.918

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$28.726

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Microchip USA

USA . 204 parts In-Stock

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Corphita

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Overview

Unlock the full potential of your electronic projects with the LM3S2U93-IQC80-A2T microcontroller by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a reliable and versatile solution for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unparalleled performance, efficiency, and flexibility. Stay ahead of the curve and bring your ideas to life with the LM3S2U93-IQC80-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring the safety and longevity of the microcontroller.

Maximum Supply Voltage: 1.365 V

Allows for efficient power management and operation within a safe voltage range.

CPU Family: CORTEX-M3

Utilizes advanced ARM Cortex-M3 architecture for high performance and energy efficiency.

ADC Channels: YES

Integrated Analog to Digital Converters enable the microcontroller to interface with various sensors and external analog devices.

RAM Bytes: 98304

Generous amount of RAM memory for data storage and processing, enhancing the performance capabilities of the microcontroller.

Maximum Clock Frequency: 16.384 MHz

High clock frequency allows for fast execution of instructions and efficient operation of the microcontroller.

Connectivity: CAN(2), I2C(2), I2S, IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3)

Multiple communication interfaces provide versatile connectivity options for interfacing with other devices and systems.

Technical Specifications

Microcontrollers LM3S2U93-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), I2S, IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3)

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(8), QEI(2), RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

LM3S2U93-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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