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LM3S2D93-IBZ80-A2

Texas Instruments

LM3S2D93-IBZ80-A2 by Texas Instruments

LM3S2D93-IBZ80-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at up to 16.384 MHz. It features 67 I/O lines, ADC and DMA channels, and 98304 bytes of RAM. Ideal for industrial applications requiring high-speed processing and multiple input/output capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,255 parts In-Stock

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Digiode

USA . 1,509 parts In-Stock

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AZTECH Wire

Italy . 797 parts In-Stock

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$14.587

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One Stop Electronics

USA . 1,209 parts In-Stock

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$20.000

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Parana Technologies

USA . 2,319 parts In-Stock

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$75.541

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DigiPath Technology Company

USA . 1,706 parts In-Stock

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$83.180

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$76.526

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ChromeModa Solutions

Germany . 3,019 parts In-Stock

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$84.878

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$69.600

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IDEA Electronic Components Group

UK . 1,891 parts In-Stock

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$84.878

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$80.634

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$76.390

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QUARKTWIN TECHNOLOGY LTD

USA . 14,899 parts In-Stock

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Corphita

USA . 1,550 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 552 parts In-Stock

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Metaverse IC Inc.

Canada . 468 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Unleash the power of innovation with the LM3S2D93-IBZ80-A2 by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this versatile device provides customers with exceptional value, performance, and efficiency. Say goodbye to limitations and hello to endless possibilities with the LM3S2D93-IBZ80-A2 - your ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within specified voltage range.

Bit Size: 32

Offers higher processing capabilities and performance for handling complex tasks and applications.

No. of Terminals: 108

Provides ample connectivity options for interfacing with various components and peripherals in a system.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperature tolerance is required for consistent performance.

CPU Family: CORTEX-M3

Utilizes efficient ARM architecture for optimized performance, power efficiency, and compatibility with industry-standard tools.

RAM Bytes: 98304

Offers ample memory for data storage and manipulation, enabling effective multitasking and data processing.

Maximum Clock Frequency: 16.384 MHz

Provides high processing speed for handling real-time operations and time-sensitive tasks with precision.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware, enabling flexibility and customization in applications.

Technical Specifications

Microcontrollers LM3S2D93-IBZ80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2D93-IBZ80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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