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LM3S2B93-IQC80-C5

Texas Instruments

LM3S2B93-IQC80-C5 by Texas Instruments

Texas Instruments LM3S2B93-IQC80-C5 is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 98304 RAM bytes. Operating at up to 16.384 MHz, it offers 67 I/O lines, PWM and ADC channels for industrial applications requiring high-speed processing in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,896 parts In-Stock

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Digiode

USA . 4,315 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 277 parts In-Stock

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$9.076

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277

$9.076

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One Stop Electronics

USA . 1,380 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 106 parts In-Stock

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$23.369

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$24.005

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106

$23.369

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$24.005

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$25.732

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1,097

$25.732

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ChromeModa Solutions

Germany . 2,011 parts In-Stock

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$26.257

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$21.531

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2,011

$26.257

$21.531

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IDEA Electronic Components Group

UK . 1,006 parts In-Stock

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$26.257

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$24.944

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$23.631

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1,006

$26.257

$24.944

$23.631

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QUARKTWIN TECHNOLOGY LTD

USA . 11,749 parts In-Stock

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Lixinc

USA . 9,634 parts In-Stock

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Corphita

USA . 3,401 parts In-Stock

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Microchip USA

USA . 2,749 parts In-Stock

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Perfect Parts

USA . 2,688 parts In-Stock

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Metaverse IC Inc.

Canada . 172 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S2B93-IQC80-C5 microcontroller from Texas Instruments. Designed with top-quality materials and cutting-edge technology, this product offers unmatched performance and reliability for a wide range of applications. Whether you're a tech enthusiast, hobbyist, or professional developer, this microcontroller provides seamless integration, powerful processing capabilities, and innovative features to bring your projects to life. Experience the difference with Texas Instruments and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently within a typical voltage range, ensuring compatibility with common power sources.

Package Shape: SQUARE

The square package shape offers a compact design that helps optimize board space and allows for easy placement in tight layouts.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and capabilities, allowing for complex applications and multitasking.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2 V, 3.3 V) offers flexibility in design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals allows for a wide range of connectivity options, enabling the microcontroller to interface with various external devices and components.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C to 85°C makes this microcontroller suitable for operation in harsh environments and industrial applications.

ADC Channels: YES

Built-in analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer and processing, improving overall system performance and responsiveness.

ROM Words: 262144

With 262,144 ROM words, this microcontroller offers ample storage for program instructions and data, accommodating complex software requirements.

RAM Bytes: 98304

A generous amount of RAM (98,304 bytes) provides ample space for data storage and processing, facilitating efficient operation of applications and tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various integrated peripherals, this product offers a streamlined and efficient architecture for embedded applications.

Technical Specifications

Microcontrollers LM3S2B93-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2B93-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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