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LM3S2950-IQC50-A2T

Texas Instruments

LM3S2950-IQC50-A2T by Texas Instruments

LM3S2950-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 50 MHz, making it ideal for industrial applications requiring high-speed processing. With 60 I/O lines and PWM channels, this microcontroller offers versatile connectivity options in a compact flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,410 parts In-Stock

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8,410

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Digiode

USA . 1,019 parts In-Stock

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1,019

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Distributors (Availability)

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One Stop Electronics

USA . 131 parts In-Stock

1+ parts

$11.000

100+ parts

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131

$11.000

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AZTECH Wire

Italy . 872 parts In-Stock

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$17.015

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872

$17.015

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Parana Technologies

USA . 1,994 parts In-Stock

1+ parts

$31.022

100+ parts

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$71.255

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1,994

$31.022

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$71.255

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DigiPath Technology Company

USA . 1,735 parts In-Stock

1+ parts

$34.159

100+ parts

$31.426

1k+ parts

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1,735

$34.159

$31.426

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ChromeModa Solutions

Germany . 5,267 parts In-Stock

1+ parts

$34.856

100+ parts

$28.582

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5,267

$34.856

$28.582

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$34.856

100+ parts

$33.113

1k+ parts

$31.370

10k+ parts

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1,524

$34.856

$33.113

$31.370

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Microchip USA

USA . 3,274 parts In-Stock

1+ parts

$45.220

100+ parts

$44.580

1k+ parts

$44.250

10k+ parts

$43.930

3,274

$45.220

$44.580

$44.250

$43.930

Corphita

USA . 4,021 parts In-Stock

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4,021

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Overview

Experience next-level performance and reliability with the LM3S2950-IQC50-A2T microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology for various applications. This microcontroller offers unparalleled value, benefits, and advantages, making it the perfect choice for your project needs. With its high-quality design and advanced features, the LM3S2950-IQC50-A2T ensures optimal performance and efficiency, helping you achieve your goals with ease. Upgrade your projects today with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures the safe operation of the microcontroller within specified limits.

Bit Size: 32

32-bit architecture provides enhanced processing power and capabilities for handling complex tasks efficiently.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages offers flexibility in designing and integrating the microcontroller into various systems.

No. of Terminals: 100

With 100 terminals, there are ample connection points for interfacing with external components and peripherals.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

ROM Words: 262144

Large ROM size of 262144 words provides ample storage for program instructions and data, accommodating complex software requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and optimized execution of instructions, enhancing the overall performance of the microcontroller.

RAM Bytes: 65536

Generous RAM capacity of 65536 bytes allows for efficient data storage and manipulation during program execution.

Technical Specifications

Microcontrollers LM3S2950-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2950-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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