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LM3S2948-EQC50-A2

Texas Instruments

LM3S2948-EQC50-A2 by Texas Instruments

Texas Instruments LM3S2948-EQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications, it offers CAN, I2C, SSI connectivity and operates at a max frequency of 50 MHz. With low power mode and integrated cache, it's suitable for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,343 parts In-Stock

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Digiode

USA . 1,084 parts In-Stock

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1,084

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Distributors (Availability)

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$10.022

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448

$10.022

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One Stop Electronics

USA . 952 parts In-Stock

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$14.000

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952

$14.000

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Parana Technologies

USA . 1,802 parts In-Stock

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$31.707

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$87.331

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$31.707

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$87.331

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IDEA Electronic Components Group

UK . 2,192 parts In-Stock

1+ parts

$35.626

100+ parts

$33.845

1k+ parts

$32.063

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2,192

$35.626

$33.845

$32.063

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ChromeModa Solutions

Germany . 331 parts In-Stock

1+ parts

$35.626

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$29.213

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331

$35.626

$29.213

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$37.826

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$34.422

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$31.017

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500

$37.826

$34.422

$31.017

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Microchip USA

USA . 1,175 parts In-Stock

1+ parts

$70.210

100+ parts

$68.990

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$68.380

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$67.760

1,175

$70.210

$68.990

$68.380

$67.760

Component Stockers USA

USA . 480 parts In-Stock

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$99.990

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480

$99.990

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Corphita

USA . 2,975 parts In-Stock

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DigiPath Technology Company

USA . 324 parts In-Stock

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$32.120

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324

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Overview

Unleash the power of cutting-edge technology with the LM3S2948-EQC50-A2 microcontroller from Texas Instruments. This high-quality product offers unmatched performance and reliability in a wide range of applications. With integrated cache, low power mode, and a variety of connectivity options, this microcontroller is designed to meet your needs with ease. Trust Texas Instruments for superior quality and innovation, and experience the value and benefits that the LM3S2948-EQC50-A2 brings to your projects. Upgrade your systems today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the microcontroller, making it a reliable choice for a variety of applications.

Integrated Cache: YES

Having an integrated cache helps improve performance by reducing memory access times, making this microcontroller suitable for tasks that require fast data processing.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures compatibility with a wide range of power sources, making this microcontroller versatile in different environments.

On Chip Data RAM Width: 8

With a data RAM width of 8 bits, this microcontroller can efficiently handle data processing tasks, making it suitable for applications that require handling of large data sets.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options, making this microcontroller suitable for applications that require interfacing with multiple external devices.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows this microcontroller to interface with analog sensors and convert their readings into digital data, making it versatile for a wide range of applications.

ROM Words: 262144

With a large ROM size of 262144 words, this microcontroller can store a significant amount of program instructions, making it suitable for applications that require complex programming logic.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency of 50 MHz allows this microcontroller to execute instructions quickly, making it suitable for applications that require fast real-time processing.

Connectivity: CAN(2), I2C, SSI(2), UART(3)

The multiple connectivity options such as CAN, I2C, SSI, and UART make this microcontroller suitable for applications that require communication with various devices and protocols.

Technical Specifications

Microcontrollers LM3S2948-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S2948-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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