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LM3S2793-IQC80-C1T

Texas Instruments

LM3S2793-IQC80-C1T by Texas Instruments

Texas Instruments' LM3S2793-IQC80-C1T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, with a temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,972 parts In-Stock

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8,972

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Digiode

USA . 4,555 parts In-Stock

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4,555

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Distributors (Availability)

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AZTECH Wire

Italy . 833 parts In-Stock

1+ parts

$10.499

100+ parts

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833

$10.499

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One Stop Electronics

USA . 702 parts In-Stock

1+ parts

$34.000

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702

$34.000

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Parana Technologies

USA . 1,757 parts In-Stock

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$66.611

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1,757

$66.611

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DigiPath Technology Company

USA . 598 parts In-Stock

1+ parts

$73.347

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598

$73.347

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IDEA Electronic Components Group

UK . 1,936 parts In-Stock

1+ parts

$74.844

100+ parts

$71.102

1k+ parts

$67.360

10k+ parts

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1,936

$74.844

$71.102

$67.360

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ChromeModa Solutions

Germany . 1,401 parts In-Stock

1+ parts

$74.844

100+ parts

$61.372

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1,401

$74.844

$61.372

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Corphita

USA . 2,027 parts In-Stock

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2,027

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Microchip USA

USA . 485 parts In-Stock

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485

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Overview

Experience the power of cutting-edge technology with the LM3S2793-IQC80-C1T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that offer unmatched performance and reliability. Perfect for a wide range of applications, this microcontroller provides advanced features such as ADC channels, DMA channels, PWM channels, and more. With its compact design and versatile capabilities, the LM3S2793-IQC80-C1T is the ideal choice for customers seeking high-value solutions for their projects. Unlock endless possibilities and elevate your designs with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

Surface Mount: YES

Can be easily mounted onto a PCB, making it suitable for compact designs and mass production.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a safe voltage range, reducing the risk of damage due to overvoltage.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, maximizing component density.

Bit Size: 32

Provides sufficient processing power for handling complex tasks and calculations.

Power Supplies (V): 1.2, 3.3

Supports multiple power supply options, offering flexibility in different operating environments.

No. of Terminals: 100

Sufficient terminals for connecting various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style ensures easy integration into the PCB layout, saving space and simplifying assembly.

Minimum Supply Voltage: 1.08 V

Can operate at a low voltage, saving power and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat generation is common.

Minimum Operating Temperature: -40 °C

Operates in cold environments without performance degradation, ideal for outdoor or harsh conditions.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for interfacing with analog sensors or signals.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances signal integrity.

ROM Words: 131072

Large ROM capacity for storing program instructions and data, suitable for complex firmware requirements.

Maximum Seated Height: 1.6 mm

Low-profile design for compact and slim device form factors.

Width: 14 mm

Narrow width for space-efficient placement on the PCB.

Maximum Clock Frequency: 0.032 MHz

Capable of high-speed operation for quick data processing and response times.

Length: 14 mm

Compact length for efficient PCB real estate utilization.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, suitable for rugged environments.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller functionality for standalone operation without external components.

RAM Bytes: 65536

Sufficient RAM capacity for data storage and computation, supporting multitasking and complex algorithms.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and reliable electrical connections.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent performance and energy efficiency.

PWM Channels: YES

Includes Pulse Width Modulation channels for precise control of analog signals and output.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and miniaturized designs.

Speed: 80 rpm

Operates at a speed of 80 revolutions per minute, suitable for various applications with timely processing requirements.

No. of I/O Lines: 67

Sufficient Input/Output lines for versatile connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers LM3S2793-IQC80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2793-IQC80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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