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LM3S2739-IQC50-A2T

Texas Instruments

LM3S2739-IQC50-A2T by Texas Instruments

Texas Instruments LM3S2739-IQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 56 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,063 parts In-Stock

1+ parts

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3,063

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Digiode

USA . 1,663 parts In-Stock

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1,663

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 568 parts In-Stock

1+ parts

$7.000

100+ parts

-

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568

$7.000

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$15.806

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431

$15.806

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Parana Technologies

USA . 2,254 parts In-Stock

1+ parts

$36.565

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2,254

$36.565

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Microchip USA

USA . 3,468 parts In-Stock

1+ parts

$38.560

100+ parts

$38.010

1k+ parts

$37.730

10k+ parts

$37.460

3,468

$38.560

$38.010

$37.730

$37.460

DigiPath Technology Company

USA . 2,152 parts In-Stock

1+ parts

$40.262

100+ parts

$37.041

1k+ parts

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2,152

$40.262

$37.041

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ChromeModa Solutions

Germany . 1,942 parts In-Stock

1+ parts

$41.084

100+ parts

$33.689

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1,942

$41.084

$33.689

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IDEA Electronic Components Group

UK . 573 parts In-Stock

1+ parts

$41.084

100+ parts

$39.030

1k+ parts

$36.976

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573

$41.084

$39.030

$36.976

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QUARKTWIN TECHNOLOGY LTD

USA . 7,295 parts In-Stock

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7,295

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Corphita

USA . 2,441 parts In-Stock

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2,441

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Overview

Experience the ultimate in performance and reliability with the LM3S2739-IQC50-A2T microcontroller from Texas Instruments. Built with cutting-edge technology and backed by a renowned manufacturer, this device is perfect for a wide range of applications. Whether you're looking to enhance your industrial automation systems or develop innovative IoT solutions, this microcontroller delivers unmatched value, efficiency, and versatility. Trust Texas Instruments to provide top-quality products that meet and exceed your expectations. Elevate your projects with the LM3S2739-IQC50-A2T microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller is energy efficient and can operate within a low power range.

Package Shape: SQUARE

The square package shape helps in optimizing board space and allows for easier placement on the PCB.

Bit Size: 32

Having a 32-bit architecture enables this microcontroller to handle more complex calculations and processes efficiently.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options (2.5V and 3.3V) allows for flexibility in designing and powering the system.

No. of Terminals: 100

With a high number of terminals, this microcontroller can support a wide range of input and output connections for various peripherals and devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, making it suitable for applications where space constraints are a concern.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation even at low power levels, enhancing the overall efficiency of the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions and industrial settings.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures the microcontroller can operate in extreme cold environments without any performance issues.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures stable electrical connections, increasing the reliability of the microcontroller.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with various sensors and input devices.

Terminal Position: QUAD

The quad terminal position offers a standard layout for easy mounting and soldering, simplifying the assembly process for the PCB.

ROM Words: 131072

With a ROM capacity of 131072 words, this microcontroller can store a large amount of program data and instructions, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm allows for a compact design and efficient PCB layout, ideal for space-constrained applications.

Width: 14 mm

The width of 14mm provides a compact form factor, making it suitable for small electronic devices and embedded systems.

Maximum Clock Frequency: 0.032 MHz

With a maximum clock frequency of 0.032MHz, this microcontroller can handle high-speed operations and real-time processing tasks effectively.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures efficient soldering and reliable connections during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for robust solder joints and ensures the longevity of the microcontroller in harsh operating conditions.

Length: 14 mm

The length of 14mm contributes to the overall compact size of the microcontroller, making it suitable for applications with limited space available.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that this microcontroller is designed to operate reliably in rugged industrial environments with high temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with integrated peripherals, this product offers efficient and optimized performance for a wide range of applications.

RAM Bytes: 65536

With a RAM capacity of 65536 bytes, this microcontroller can support multitasking, data storage, and efficient data processing for complex tasks.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption, high noise immunity, and reliable operation, making it energy-efficient and durable.

Terminal Form: GULL WING

The gull wing terminal form provides a strong mechanical bond and easy soldering, ensuring secure connections and long-term reliability.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V optimizes the power efficiency of the microcontroller while maintaining stable operation levels for the system.

PWM Channels: YES

The availability of PWM channels enables precise control over the output signals, making this microcontroller suitable for applications requiring accurate analog output.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updates to the program code, enhancing flexibility and adaptability in system design.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting on the PCB, saving space and allowing for compact designs in electronic devices.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller can withstand moderate exposure to humidity during storage and operation.

Speed: 50 rpm

The speed of 50 revolutions per minute indicates the processing capability of this microcontroller for handling tasks efficiently within a specific operating range.

No. of I/O Lines: 56

With 56 I/O lines, this microcontroller can interface with various external devices, sensors, and components, enabling versatile connectivity options for diverse applications.

Technical Specifications

Microcontrollers LM3S2739-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2739-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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