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LM3S2739-IQC50-A2

Texas Instruments

LM3S2739-IQC50-A2 by Texas Instruments

LM3S2739-IQC50-A2 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, featuring 131072 ROM words and 65536 RAM bytes. It offers 4-Ch 10-Bit ADC channels, PWM(6), QEI, TIMER(3), WDT peripherals for industrial applications requiring low power mode and CAN, I2C, SSI, UART(2) connectivity at a max clock frequency of 0.032 MHz.

Median Price

$16.960

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$4.052

100+ parts

-

1k+ parts

-

10k+ parts

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10

$4.052

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-

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Verical

USA . 10 parts In-Stock

1+ parts

$16.960

100+ parts

-

1k+ parts

-

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10

$16.960

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-

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Chip1Stop

Japan . 90 parts In-Stock

1+ parts

-

100+ parts

$18.360

1k+ parts

-

10k+ parts

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90

-

$18.360

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,407 parts In-Stock

1+ parts

$14.278

100+ parts

-

1k+ parts

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2,407

$14.278

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-

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Vyrian

USA . 8,394 parts In-Stock

1+ parts

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8,394

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 37 parts In-Stock

1+ parts

$12.780

100+ parts

-

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-

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37

$12.780

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-

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Corphita

USA . 4,837 parts In-Stock

1+ parts

$13.527

100+ parts

-

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10k+ parts

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4,837

$13.527

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-

-

Component Stockers USA

USA . 26 parts In-Stock

1+ parts

$17.560

100+ parts

-

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26

$17.560

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AZTECH Wire

Italy . 1,170 parts In-Stock

1+ parts

$17.650

100+ parts

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10k+ parts

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1,170

$17.650

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Microchip USA

USA . 446 parts In-Stock

1+ parts

$48.190

100+ parts

$47.770

1k+ parts

$47.770

10k+ parts

$47.350

446

$48.190

$47.770

$47.770

$47.350

Parana Technologies

USA . 193 parts In-Stock

1+ parts

$49.475

100+ parts

-

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193

$49.475

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DigiPath Technology Company

USA . 1,921 parts In-Stock

1+ parts

$54.478

100+ parts

-

1k+ parts

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10k+ parts

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1,921

$54.478

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ChromeModa Solutions

Germany . 1,225 parts In-Stock

1+ parts

$55.590

100+ parts

$45.584

1k+ parts

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1,225

$55.590

$45.584

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IDEA Electronic Components Group

UK . 816 parts In-Stock

1+ parts

$55.590

100+ parts

$52.810

1k+ parts

$50.031

10k+ parts

-

816

$55.590

$52.810

$50.031

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Kepictronics

USA . 66 parts In-Stock

1+ parts

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66

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Overview

Get ready to revolutionize your projects with the LM3S2739-IQC50-A2 microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that provide reliable performance and unmatched durability. Designed for a wide range of applications, this microcontroller offers integrated cache, multiple power supply options, and a variety of peripherals like PWM and timers. With a compact package size and low power mode, the LM3S2739-IQC50-A2 ensures efficiency without compromising on functionality. Say hello to seamless connectivity and enhanced productivity with this cutting-edge microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves performance by reducing memory access times and increasing overall processing speed.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and prevents damage to the microcontroller.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family is known for its energy efficiency and high performance, making it a reliable choice for various applications.

ROM Words: 131072

With a ROM capacity of 131072 words, the microcontroller can store a large amount of program data, allowing for complex functionality.

Maximum Clock Frequency: 0.032 MHz

A high maximum clock frequency of 0.032 MHz enables the microcontroller to process instructions quickly and efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient data processing and reduced power consumption, making it suitable for battery-powered devices.

Analog To Digital Convertors: 4-Ch 10-Bit

The 4-channel 10-bit ADCs allow for precise analog signal conversion, making the microcontroller ideal for applications requiring accurate sensor data.

Connectivity: CAN, I2C, SSI, UART(2)

The multiple connectivity options such as CAN, I2C, SSI, and UART allow for easy integration with various peripheral devices, enhancing the product's versatility.

Speed: 50 rpm

With a speed of 50 rpm, the microcontroller can handle real-time processing tasks efficiently, making it suitable for applications where speed is crucial.

Technical Specifications

Microcontrollers LM3S2739-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART(2)

Peripherals:

PWM(6), QEI, TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S2739-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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