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LM3S2730-IQC50-A2

Texas Instruments

LM3S2730-IQC50-A2 by Texas Instruments

Texas Instruments' LM3S2730-IQC50-A2 microcontroller features 32-bit architecture, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications with a temperature range of -40 to 85°C, it offers PWM channels, ADC support, and operates at a max clock frequency of 0.032 MHz.

Median Price

$13.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$10.760

1k+ parts

$9.630

10k+ parts

$9.060

90

-

$10.760

$9.630

$9.060

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$14.160

1k+ parts

-

10k+ parts

-

90

-

$14.160

-

-

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$13.450

1k+ parts

$12.037

10k+ parts

$11.325

90

-

$13.450

$12.037

$11.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,165 parts In-Stock

1+ parts

$11.362

100+ parts

-

1k+ parts

-

10k+ parts

-

4,165

$11.362

-

-

-

Vyrian

USA . 4,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,532

-

-

-

-

DigiKey Marketplace

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 52 parts In-Stock

1+ parts

$10.764

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$10.764

-

-

-

Microchip USA

USA . 253 parts In-Stock

1+ parts

$32.140

100+ parts

$31.680

1k+ parts

$31.460

10k+ parts

$31.230

253

$32.140

$31.680

$31.460

$31.230

Parana Technologies

USA . 588 parts In-Stock

1+ parts

$65.822

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$65.822

-

-

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ChromeModa Solutions

Germany . 6,851 parts In-Stock

1+ parts

$73.957

100+ parts

$60.645

1k+ parts

-

10k+ parts

-

6,851

$73.957

$60.645

-

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IDEA Electronic Components Group

UK . 1,906 parts In-Stock

1+ parts

$73.957

100+ parts

$70.259

1k+ parts

$66.561

10k+ parts

-

1,906

$73.957

$70.259

$66.561

-

DigiPath Technology Company

USA . 215 parts In-Stock

1+ parts

-

100+ parts

$66.680

1k+ parts

-

10k+ parts

-

215

-

$66.680

-

-

Overview

Unleash the power of innovation with the LM3S2730-IQC50-A2 microcontroller by Texas Instruments. With a reputation for excellence in manufacturing, this device boasts cutting-edge technology and unmatched reliability. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value, benefits, and advantages. Whether you're looking to enhance your project's performance or streamline your operations, the LM3S2730-IQC50-A2 delivers top-notch quality and efficiency that will take your design to the next level. Elevate your work with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time during manufacturing.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Square shape provides a compact form factor, saving space in the overall design of the electronic device.

Bit Size: 32

32-bit architecture offers high processing power and performance capabilities for various applications.

Power Supplies (V): 2.5, 3.3

Multiple power supply options allow for flexibility in different voltage requirements for different components.

No. of Terminals: 100

Sufficient number of terminals for connecting various peripherals and components to the microcontroller.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function in harsh environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program code and data.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing and response times for real-time applications.

RAM Bytes: 65536

Generous RAM capacity for temporary data storage and efficient multitasking capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for the microcontroller's operations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

PWM Channels: YES

Pulse-width modulation channels enable precise control of connected devices such as motors or LEDs.

Technical Specifications

Microcontrollers LM3S2730-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2730-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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