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LM3S2671-IQR50-A0T

Texas Instruments

LM3S2671-IQR50-A0T by Texas Instruments

Texas Instruments LM3S2671-IQR50-A0T microcontroller features 32-bit CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it supports CAN, I2C, SSI, UART connectivity with low power mode and integrated cache for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,116 parts In-Stock

1+ parts

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7,116

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Digiode

USA . 4,176 parts In-Stock

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4,176

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 713 parts In-Stock

1+ parts

$14.859

100+ parts

-

1k+ parts

$15.289

10k+ parts

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713

$14.859

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$15.289

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DigiPath Technology Company

USA . 730 parts In-Stock

1+ parts

$16.361

100+ parts

-

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730

$16.361

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$16.695

100+ parts

$15.860

1k+ parts

$15.026

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-

2,130

$16.695

$15.860

$15.026

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ChromeModa Solutions

Germany . 1,905 parts In-Stock

1+ parts

$16.695

100+ parts

$13.690

1k+ parts

-

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1,905

$16.695

$13.690

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AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$16.914

100+ parts

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1k+ parts

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666

$16.914

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One Stop Electronics

USA . 257 parts In-Stock

1+ parts

$30.000

100+ parts

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257

$30.000

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Corphita

USA . 438 parts In-Stock

1+ parts

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438

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Overview

Unlock the power of innovative technology with the LM3S2671-IQR50-A0T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this product offers unmatched value with its integrated cache, low power mode, and variety of peripherals including DMA, PWM, TIMER, and WDT. Experience seamless connectivity with CAN, I2C, SSI, and UART options, all while enjoying the benefits of high performance and efficiency. Elevate your projects with the LM3S2671-IQR50-A0T and discover endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller durable and resistant to external factors, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and speed of the microcontroller by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V makes it efficient in terms of power consumption while still providing enough voltage for optimal performance.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 ensures that the microcontroller can handle and process large amounts of data efficiently.

Package Shape: SQUARE

The square package shape makes it easier to mount and integrate the microcontroller on PCBs, saving space and ensuring a compact design.

Bit Size: 32

With a bit size of 32, this microcontroller can handle complex calculations and data processing tasks effectively, making it suitable for a wide range of applications.

Power Supplies (V): 2.5,3.3

The multiple power supply options of 2.5V and 3.3V allow flexibility in powering the microcontroller based on the specific requirements of the application.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing its versatility.

Package Style (Meter): FLATPACK

The flatpack package style makes it easier to solder and mount the microcontroller onto PCBs, providing a reliable and secure connection.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures that the microcontroller can operate efficiently even under low power conditions, enhancing its reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family signifies that this microcontroller offers high performance, low power consumption, and advanced features for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can function in cold environments without compromising its performance, making it suitable for diverse applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection for the microcontroller.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with sensors and other analog devices effectively.

Terminal Position: QUAD

The quad terminal position makes it easier to solder and mount the microcontroller onto the PCB, ensuring a secure and stable connection.

ROM Words: 131072

With a ROM size of 131072 words, this microcontroller has ample memory capacity for storing program instructions and data, making it suitable for complex applications.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm ensures that the microcontroller can be mounted in compact spaces without compromising its performance or functionality.

Width: 10 mm

With a width of 10 mm, this microcontroller is compact and can be easily integrated into small electronic devices or applications where space is a constraint.

Boundary Scan: YES

The boundary scan feature allows for testing and debugging of the microcontroller during production and maintenance, ensuring reliability and ease of troubleshooting.

Peripherals: DMA, PWM(2), TIMER(4), WDT

The presence of peripherals such as DMA, PWM, timers, and WDT enhances the functionality and capabilities of the microcontroller, enabling it to perform a variety of tasks efficiently.

Maximum Clock Frequency: 0.032 MHz

With a maximum clock frequency of 0.032 MHz, this microcontroller can operate at high speeds, ensuring fast processing of data and instructions for quick response times.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the microcontroller can be soldered onto the PCB with precision and reliability during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the temperature tolerance of the microcontroller during the soldering process, ensuring proper soldering and connection.

Length: 10 mm

With a length of 10 mm, this microcontroller is compact and can be easily integrated into various electronic devices or applications with limited space available.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the microcontroller can operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, this product offers enhanced performance, power efficiency, and high processing speed for a wide range of applications.

No. of Timers: 4

Having 4 timers allows the microcontroller to manage time-critical tasks, schedule events, and control external devices with precision, enhancing its overall functionality.

RAM Bytes: 32768

With a RAM size of 32768 bytes, this microcontroller has sufficient memory capacity to store and process data during operation, ensuring smooth performance in various applications.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption, high noise immunity, and reliable performance, making it suitable for battery-powered devices and other applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and mounting of the microcontroller onto the PCB, ensuring a secure and stable electrical connection.

Analog To Digital Convertors: 4-Ch 10-Bit

The presence of 4-channel 10-bit ADCs enables the microcontroller to convert analog signals into digital data with high resolution and accuracy, allowing it to interface with a variety of sensors and devices effectively.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a stable power source for the microcontroller, ensuring consistent performance and operation in various applications.

No. of Serial I/Os: 4

With 4 serial I/Os, the microcontroller can communicate with multiple external devices simultaneously, enabling data exchange and control functionalities in diverse applications.

PWM Channels: YES

The availability of PWM channels allows the microcontroller to generate precise pulse-width modulation signals for controlling motor speed, LED brightness, and other analog devices with accuracy.

Connectivity: CAN, I2C, SSI, UART

Supporting various communication interfaces such as CAN, I2C, SSI, and UART, this microcontroller offers versatile connectivity options for interfacing with a wide range of devices and systems.

ROM Programmability: FLASH

Having flash ROM programmability allows for easy and flexible programming of the microcontroller, enabling firmware updates and customization as per specific application requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller can be easily mounted and soldered onto PCBs with fine pitch components, ensuring a robust and reliable connection.

Format: FIXED POINT

Utilizing a fixed-point format for calculations and data processing enables precise and accurate numerical operations, making this microcontroller suitable for applications requiring high computational accuracy.

Technical Specifications

Microcontrollers LM3S2671-IQR50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART

Peripherals:

DMA, PWM(2), TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S2671-IQR50-A0T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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