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LM3S2651-EQC50-A2T

Texas Instruments

LM3S2651-EQC50-A2T by Texas Instruments

LM3S2651-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 105 °C, it offers versatile performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,657 parts In-Stock

1+ parts

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2,657

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Digiode

USA . 1,068 parts In-Stock

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1,068

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,471 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,471

$8.000

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AZTECH Wire

Italy . 312 parts In-Stock

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$9.550

100+ parts

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312

$9.550

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Parana Technologies

USA . 1,916 parts In-Stock

1+ parts

$22.834

100+ parts

-

1k+ parts

$23.497

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1,916

$22.834

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$23.497

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DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$25.143

100+ parts

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1,125

$25.143

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ChromeModa Solutions

Germany . 3,699 parts In-Stock

1+ parts

$25.656

100+ parts

$21.038

1k+ parts

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10k+ parts

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3,699

$25.656

$21.038

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IDEA Electronic Components Group

UK . 1,704 parts In-Stock

1+ parts

$25.656

100+ parts

$24.373

1k+ parts

$23.090

10k+ parts

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1,704

$25.656

$24.373

$23.090

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Corphita

USA . 3,355 parts In-Stock

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3,355

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Microchip USA

USA . 398 parts In-Stock

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398

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Overview

Revolutionize your projects with the LM3S2651-EQC50-A2T by Texas Instruments, a cutting-edge microcontroller designed to deliver unparalleled performance and reliability. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in all their products. Ideal for a wide range of applications, this microcontroller offers customers exceptional value and benefits, including advanced features and seamless integration. Experience the advantages of Texas Instruments technology and take your projects to the next level with the LM3S2651-EQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, helping to conserve energy.

Bit Size: 32

Offers high computational power and efficiency for processing tasks.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it versatile for various environments.

ROM Words: 131072

Large memory capacity for storing program instructions and data.

RAM Bytes: 32768

Sufficient random-access memory for temporary data storage and processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient instruction execution, enhancing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Clock Frequency: 0.032 MHz

Can handle high-speed operations, ensuring quick response times.

Technical Specifications

Microcontrollers LM3S2651-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2651-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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