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LM3S2608-EQC50-A2T

Texas Instruments

LM3S2608-EQC50-A2T by Texas Instruments

Texas Instruments LM3S2608-EQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 52 I/O lines, PWM channels, and ADC channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,505 parts In-Stock

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2,505

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Digiode

USA . 1,738 parts In-Stock

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1,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 562 parts In-Stock

1+ parts

$14.448

100+ parts

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562

$14.448

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One Stop Electronics

USA . 1,125 parts In-Stock

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$23.000

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1,125

$23.000

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Parana Technologies

USA . 1,545 parts In-Stock

1+ parts

$50.710

100+ parts

$4,709.232

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$45.639

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1,545

$50.710

$4,709.232

$45.639

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DigiPath Technology Company

USA . 486 parts In-Stock

1+ parts

$55.838

100+ parts

$51.371

1k+ parts

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486

$55.838

$51.371

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ChromeModa Solutions

Germany . 6,381 parts In-Stock

1+ parts

$56.978

100+ parts

$46.722

1k+ parts

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6,381

$56.978

$46.722

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IDEA Electronic Components Group

UK . 2,368 parts In-Stock

1+ parts

$56.978

100+ parts

$54.129

1k+ parts

$51.280

10k+ parts

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2,368

$56.978

$54.129

$51.280

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Corphita

USA . 2,017 parts In-Stock

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Microchip USA

USA . 261 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S2608-EQC50-A2T by Texas Instruments. As a leading manufacturer in the field of microcontrollers, Texas Instruments delivers high-quality products that cater to a wide range of applications. The LM3S2608-EQC50-A2T stands out for its reliability, efficiency, and versatility, providing customers with exceptional value and benefits. Whether you are working on industrial automation, consumer electronics, or IoT devices, this microcontroller is the perfect choice to bring your ideas to life. Trust Texas Instruments to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V provides flexibility in power supply options while also ensuring safe operation of the microcontroller.

Bit Size: 32

The 32-bit architecture allows for high performance and efficient processing capabilities, suitable for complex applications.

Power Supplies (V): 2.5,3.3

Supporting multiple power supply options offers versatility in design and compatibility with different power sources.

No. of Terminals: 100

Having 100 terminals allows for various connections and interfaces, enabling a wide range of input and output options for the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style helps in efficient PCB layout and space-saving design, making it suitable for compact electronic devices.

Minimum Supply Voltage: 2.25 V

With a minimum supply voltage of 2.25 V, the microcontroller can operate effectively even with lower power sources, enhancing its versatility.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance in various environmental conditions, including industrial settings.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) allows the microcontroller to function in extreme cold conditions, expanding its usability.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to process analog signals, enhancing its capability in sensor applications.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, ensuring reliable performance in various circuit configurations.

ROM Words: 131072

With a large ROM size of 131072 words, the microcontroller can store a significant amount of program memory, suitable for complex software requirements.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for slim and compact device designs, making it ideal for space-constrained applications.

Width: 14 mm

The compact width of 14 mm enables easy integration into small electronic devices or densely populated PCBs.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz ensures efficient and fast processing speed, suitable for real-time applications that require quick responses.

Length: 14 mm

The compact length of 14 mm allows for space-saving PCB designs and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions commonly found in industrial settings, making it a robust choice for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with Reduced Instruction Set Computing (RISC) architecture provides efficient and streamlined processing, suitable for high-performance applications requiring quick data processing.

RAM Bytes: 32768

With a generous amount of RAM storage (32768 bytes), the microcontroller can handle multiple tasks simultaneously and store temporary data efficiently.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and reliable performance, making it an energy-efficient choice for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and ease of mounting, ensuring robust electrical connections for stable performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V serves as a standard operating voltage, providing compatibility with common power sources and ensuring consistent performance.

PWM Channels: YES

The Pulse-Width Modulation (PWM) channels allow for precise control of digital signals and motor speed, making the microcontroller suitable for applications requiring accurate pulse control.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy and quick reprogramming of the microcontroller, enabling flexibility and adaptability in changing application requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on PCBs, maximizing space utilization and allowing for compact system designs.

Speed: 50 rpm

With a speed of 50 rpm, the microcontroller can process instructions and data efficiently, ensuring smooth operation and optimal performance.

No. of I/O Lines: 52

Having 52 Input/Output (I/O) lines offers versatility in interfacing with external devices and peripherals, allowing for flexible connectivity and functionality.

Technical Specifications

Microcontrollers LM3S2608-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2608-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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