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LM3S2412-IQC25-A2

Texas Instruments

LM3S2412-IQC25-A2 by Texas Instruments

Texas Instruments LM3S2412-IQC25-A2 microcontroller features 32-bit Cortex-M3 CPU, 32768 bytes RAM, and 98304 ROM words. With CAN, I2C, UART connectivity and PWM(2), TIMER(3) peripherals, it's ideal for industrial applications requiring low power mode and ADC channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,580 parts In-Stock

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Digiode

USA . 2,437 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 772 parts In-Stock

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$5.000

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772

$5.000

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AZTECH Wire

Italy . 413 parts In-Stock

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$13.388

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413

$13.388

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Ampacity Inc.

Singapore . 206 parts In-Stock

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$16.000

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206

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Parana Technologies

USA . 1,855 parts In-Stock

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$36.509

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$36.509

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DigiPath Technology Company

USA . 1,227 parts In-Stock

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$40.201

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$36.985

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1,227

$40.201

$36.985

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ChromeModa Solutions

Germany . 3,963 parts In-Stock

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$41.021

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$33.637

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$41.021

$33.637

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IDEA Electronic Components Group

UK . 620 parts In-Stock

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$41.021

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$38.970

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$36.919

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620

$41.021

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$36.919

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Corphita

USA . 3,168 parts In-Stock

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Microchip USA

USA . 181 parts In-Stock

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Overview

Elevate your projects with the LM3S2412-IQC25-A2 microcontroller from Texas Instruments, a powerhouse in innovation and reliability. Designed for a wide range of applications, this high-quality device offers integrated cache, low power mode, and versatile connectivity options like CAN, I2C, SSI, and UART. With a robust package body material and industrial temperature grade, this Cortex-M3 CPU family member delivers exceptional performance and value. Whether you're creating IoT devices or industrial automation solutions, trust Texas Instruments to provide top-notch quality and cutting-edge technology. Upgrade your projects today with the LM3S2412-IQC25-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, ensuring reliable performance and durability.

Integrated Cache: YES

The integrated cache helps improve processing speed by storing frequently accessed data for quick retrieval, enhancing overall performance.

Maximum Supply Voltage: 2.75 V

A moderate maximum supply voltage allows for efficient power consumption and reliable operation within safe voltage limits.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, this microcontroller can efficiently process data in smaller chunks, optimizing memory usage and performance.

Package Shape: SQUARE

The square package shape offers easy mounting and compatibility with various PCB layouts, simplifying installation and integration.

Bit Size: 32

A 32-bit architecture enables high-speed processing and handling of complex calculations, making this microcontroller suitable for demanding applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 100

A higher number of terminals provide more connectivity options and peripheral interfaces, enhancing versatility and functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-efficient design, making it suitable for applications where size constraints are a concern.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage ensures stable operation even under low voltage conditions, improving reliability and performance consistency.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and conversion, facilitating sensor interfacing and analog input handling.

Maximum Clock Frequency: 0.032 MHz

A high maximum clock frequency allows for fast data processing and response times, enhancing overall system performance and efficiency.

Technical Specifications

Microcontrollers LM3S2412-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

49

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART

Peripherals:

PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

LM3S2412-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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