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LM3S2410-EQC25-A2

Texas Instruments

LM3S2410-EQC25-A2 by Texas Instruments

Texas Instruments LM3S2410-EQC25-A2 is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. Operating at up to 0.032 MHz, it features 60 I/O lines, PWM channels, and ADC channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,190 parts In-Stock

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Digiode

USA . 4,924 parts In-Stock

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AZTECH Wire

Italy . 607 parts In-Stock

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$18.905

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One Stop Electronics

USA . 218 parts In-Stock

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$32.000

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218

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Parana Technologies

USA . 2,142 parts In-Stock

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$68.282

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$6,340.991

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$61.454

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2,142

$68.282

$6,340.991

$61.454

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DigiPath Technology Company

USA . 1,387 parts In-Stock

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$75.187

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$69.172

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

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$76.721

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$72.885

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$69.049

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2,238

$76.721

$72.885

$69.049

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ChromeModa Solutions

Germany . 2,067 parts In-Stock

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$76.721

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$62.911

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QUARKTWIN TECHNOLOGY LTD

USA . 17,293 parts In-Stock

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Corphita

USA . 4,030 parts In-Stock

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Microchip USA

USA . 3,550 parts In-Stock

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Overview

Elevate your projects with the LM3S2410-EQC25-A2 by Texas Instruments, a top-of-the-line microcontroller that delivers unparalleled performance and reliability. With a reputation for excellence in the industry, Texas Instruments ensures top-notch quality and innovation in every product they create. Ideal for a wide range of applications, this microcontroller offers exceptional value and benefits to customers seeking cutting-edge technology. Experience the advantages of advanced features and seamless functionality with the LM3S2410-EQC25-A2, setting a new standard in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability to the product.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications.

Package Shape: SQUARE

Easily fits into compact designs.

Bit Size: 32

Provides sufficient processing power for various tasks.

Power Supplies (V): 2.5,3.3

Versatile voltage options for different operating conditions.

No. of Terminals: 100

Provides ample connectivity options.

Package Style (Meter): FLATPACK

Ensures easy handling during assembly.

Minimum Supply Voltage: 2.25 V

Ensures stable operation at lower voltages.

Maximum Operating Temperature: 105 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Terminal Finish: TIN

Provides good electrical conductivity.

ADC Channels: YES

Allows for analog signal processing.

Terminal Position: QUAD

Facilitates easy connection to external components.

ROM Words: 98304

Sufficient memory for storing programs and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact form factor for integration into designs.

Maximum Clock Frequency: 0.032 MHz

Capable of fast processing speeds.

Length: 14 mm

Compact size for space efficiency.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient data processing.

RAM Bytes: 32768

Sufficient random access memory for temporary data storage.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering during assembly.

Nominal Supply Voltage: 2.5 V

Standard voltage for stable operation.

PWM Channels: YES

Allows for precise control over output signals.

ROM Programmability: FLASH

Easily reprogrammable memory for firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch for compact layout designs.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate exposure to moisture during handling.

Speed: 25 rpm

Capable of handling tasks at a reasonable speed.

No. of I/O Lines: 60

Provides sufficient input/output options for external connectivity.

Technical Specifications

Microcontrollers LM3S2410-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2410-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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