Loading...

LM3S2276-IQR50-A0

Texas Instruments

LM3S2276-IQR50-A0 by Texas Instruments

Texas Instruments LM3S2276-IQR50-A0 microcontroller features 32-bit CPU, 32768 bytes RAM, and 65536 ROM words. Ideal for industrial applications with CAN, I2C, UART connectivity options and low power mode support. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

$14.580

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 453 parts In-Stock

1+ parts

-

100+ parts

$13.530

1k+ parts

$12.100

10k+ parts

$11.390

453

-

$13.530

$12.100

$11.390

DigiKey

USA . 453 parts In-Stock

1+ parts

-

100+ parts

$15.630

1k+ parts

-

10k+ parts

-

453

-

$15.630

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,513 parts In-Stock

1+ parts

$14.278

100+ parts

-

1k+ parts

-

10k+ parts

-

3,513

$14.278

-

-

-

Vyrian

USA . 8,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,275

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 343 parts In-Stock

1+ parts

$12.780

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$12.780

-

-

-

Corphita

USA . 2,656 parts In-Stock

1+ parts

$13.527

100+ parts

-

1k+ parts

-

10k+ parts

-

2,656

$13.527

-

-

-

Parana Technologies

USA . 314 parts In-Stock

1+ parts

$64.691

100+ parts

-

1k+ parts

-

10k+ parts

-

314

$64.691

-

-

-

ChromeModa Solutions

Germany . 3,464 parts In-Stock

1+ parts

$72.687

100+ parts

$59.603

1k+ parts

-

10k+ parts

-

3,464

$72.687

$59.603

-

-

IDEA Electronic Components Group

UK . 688 parts In-Stock

1+ parts

$72.687

100+ parts

$69.053

1k+ parts

$65.418

10k+ parts

-

688

$72.687

$69.053

$65.418

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

DigiPath Technology Company

USA . 359 parts In-Stock

1+ parts

-

100+ parts

$65.535

1k+ parts

-

10k+ parts

-

359

-

$65.535

-

-

Microchip USA

USA . 302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

302

-

-

-

-

Overview

Unlock the power of innovation with the LM3S2276-IQR50-A0 microcontroller by Texas Instruments. Harnessing cutting-edge technology and superior craftsmanship, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller boasts integrated features such as cache memory and multiple peripherals, ensuring seamless operation and maximum efficiency. Trust Texas Instruments to deliver quality, reliability, and value with the LM3S2276-IQR50-A0 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ideal for applications where durability and protection against external elements is required.

Integrated Cache: YES

Improves overall performance by storing frequently used data for faster access.

Maximum Supply Voltage: 2.75 V

Allows for efficient power usage while still providing enough power for the microcontroller to operate effectively.

CPU Family: CORTEX-M3

Belongs to a respected and widely used CPU family known for its efficiency and performance capabilities.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC-based architecture for enhanced performance and efficient execution of instructions.

Analog To Digital Convertors: 6-Ch 10-Bit

Provides multiple channels for converting analog signals to digital data with high precision.

Connectivity: CAN, I2C, SSI, UART

Offers a range of connectivity options to communicate with external devices or networks efficiently.

ROM Programmability: FLASH

Utilizes flash memory for programmability, allowing for easy updates and modifications to the firmware.

Moisture Sensitivity Level (MSL): 3

Ensures that the microcontroller can withstand a moderate level of moisture exposure without compromising its functionality.

Technical Specifications

Microcontrollers LM3S2276-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART

Peripherals:

DMA, PWM(8), TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S2276-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20