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LM3S2139-IQC25-A2

Texas Instruments

LM3S2139-IQC25-A2 by Texas Instruments

Texas Instruments LM3S2139-IQC25-A2 microcontroller features 32-bit architecture, 8KB RAM, and 4 ADC channels. Ideal for industrial applications with CAN, I2C, UART connectivity options. Operates at -40 to 85°C temperature range with low power mode support.

Median Price

$24.729

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 19 parts In-Stock

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$24.729

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Digiode

USA . 4,279 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 34 parts In-Stock

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Dan-Mar Components

USA . 19 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 582 parts In-Stock

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$14.523

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$22.057

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$20.072

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$18.087

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$22.057

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$18.087

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One Stop Electronics

USA . 964 parts In-Stock

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$29.000

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Parana Technologies

USA . 2,151 parts In-Stock

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$66.668

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$6,191.146

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$60.001

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Microchip USA

USA . 281 parts In-Stock

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$68.580

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$67.990

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$67.990

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$67.390

281

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$67.390

DigiPath Technology Company

USA . 1,020 parts In-Stock

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$73.410

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ChromeModa Solutions

Germany . 958 parts In-Stock

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$74.908

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$61.425

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IDEA Electronic Components Group

UK . 221 parts In-Stock

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$71.163

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$67.417

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Component Stockers USA

USA . 789 parts In-Stock

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Lixinc

USA . 7,635 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 254 parts In-Stock

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Kepictronics

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Perfect Parts

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Overview

Experience the power of innovation with the LM3S2139-IQC25-A2 microcontroller from Texas Instruments. Designed with cutting-edge technology, this device boasts integrated cache and a wide range of peripherals, making it ideal for various applications. With a compact package and low power mode, this microcontroller offers unmatched efficiency and reliability. Trust in Texas Instruments' reputation for quality and discover the endless possibilities with the LM3S2139-IQC25-A2. Elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring product longevity and affordability.

Integrated Cache: YES

Improved performance and efficiency due to integrated cache memory.

Maximum Supply Voltage: 2.75 V

Optimal voltage range for stable operation and power efficiency.

On Chip Data RAM Width: 8

Efficient data processing with a wide on-chip data RAM width.

Address Bus Width: 8

Enhanced memory addressing capabilities with a wide address bus width.

Bit Size: 32

Higher processing capabilities with a 32-bit architecture.

Power Supplies (V): 2.5,3.3

Flexibility and compatibility with multiple power supply options.

No. of Terminals: 100

Sufficient number of terminals for connectivity and expansion options.

No. of Timers: 3

Multiple timer options for precise timing and scheduling.

ADC Channels: YES

Analog-to-Digital Converter channels for interfacing with analog sensors and devices.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

Connectivity: CAN, I2C, SSI, UART(2)

Versatile connectivity options for interfacing with a variety of devices and networks.

Peripheral IC Type: MICROCONTROLLER, RISC

Specialized peripheral IC type for microcontroller applications with reduced instruction set computing capabilities.

ROM Programmability: FLASH

Programmable ROM memory with flash technology for easy firmware updates and modifications.

Technical Specifications

Microcontrollers LM3S2139-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S2139-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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