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LM3S2139-IBZ25-A2T

Texas Instruments

LM3S2139-IBZ25-A2T by Texas Instruments

Texas Instruments LM3S2139-IBZ25-A2T is a 32-bit microcontroller with 108 terminals, operating at up to 25 MHz. It features 8-bit address bus width, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring a max supply voltage of 2.75 V and operating temperature range from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,989 parts In-Stock

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7,989

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Digiode

USA . 1,577 parts In-Stock

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1,577

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Distributors (Availability)

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AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$12.048

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443

$12.048

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One Stop Electronics

USA . 1,181 parts In-Stock

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$31.000

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1,181

$31.000

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Parana Technologies

USA . 1,485 parts In-Stock

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$47.918

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$47.918

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Microchip USA

USA . 3,387 parts In-Stock

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$49.730

100+ parts

$49.020

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$48.670

10k+ parts

$48.310

3,387

$49.730

$49.020

$48.670

$48.310

ChromeModa Solutions

Germany . 3,162 parts In-Stock

1+ parts

$53.841

100+ parts

$44.150

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3,162

$53.841

$44.150

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IDEA Electronic Components Group

UK . 489 parts In-Stock

1+ parts

$53.841

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$51.149

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$48.457

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489

$53.841

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$48.457

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Corphita

USA . 3,774 parts In-Stock

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3,774

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DigiPath Technology Company

USA . 610 parts In-Stock

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$48.543

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610

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Overview

Elevate your projects with the LM3S2139-IBZ25-A2T microcontroller by Texas Instruments. Crafted with precision and quality in mind, this powerful device offers a wide range of applications in various industries. With its innovative design and reliable performance, this microcontroller provides exceptional value and benefits to customers looking for efficiency and versatility in their projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your next endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides durability and protection for the microcontroller, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production processes.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75V, this microcontroller is efficient in power consumption, making it suitable for low power applications.

Address Bus Width: 8

An address bus width of 8 allows for efficient memory addressing and data transfer, enhancing overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape allows for compact and space-saving design, ideal for applications where size constraints are a consideration.

Bit Size: 32

32-bit architecture provides enhanced computational capabilities and performance, making this microcontroller suitable for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in design and compatibility with a wide range of external components.

No. of Terminals: 108

With 108 terminals, this microcontroller offers sufficient I/O capabilities for connecting to external devices and peripherals, making it versatile for a variety of applications.

Package Style (Meter): GRID ARRAY

Grid array package style enhances thermal performance and reliability, making it suitable for high-temperature industrial applications.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage of 2.25V ensures efficient power consumption and operation in low power scenarios.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller is suitable for industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Wide operating temperature range (-40°C to 85°C) ensures reliable performance in extreme temperature conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices, expanding its functionality for a wide range of applications.

DMA Channels: YES

Direct memory access channels enhance data transfer efficiency and speed, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, simplifying the manufacturing process.

ROM Words: 65536

With a ROM size of 65536 words, this microcontroller offers ample storage for program code and data, enabling complex applications to be implemented.

Maximum Seated Height: 1.5 mm

Low maximum seated height of 1.5mm allows for compact and slim device designs, suitable for space-constrained applications.

Width: 10 mm

Compact width of 10mm makes this microcontroller suitable for small form factor designs and applications where space is limited.

External Data Bus Width: 32

Wide external data bus width of 32 bits allows for fast data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25MHz enables fast and efficient execution of instructions, making this microcontroller suitable for real-time processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly processes during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C indicates robust thermal tolerance, making this microcontroller suitable for lead-free assembly processes.

Length: 10 mm

Compact length of 10mm allows for space-efficient PCB layout and design, ideal for small electronic devices and systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions, making this microcontroller suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution and low power consumption, making it suitable for battery-powered devices and embedded systems.

RAM Bytes: 16384

Ample RAM size of 16384 bytes provides sufficient memory for data storage and processing, enhancing the microcontroller's capabilities for multi-tasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for long-term operation.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and assembly, ensuring reliable connections and reducing the risk of solder joints failures.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation of the microcontroller in various power supply conditions.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog signals, making this microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modification, ensuring flexibility and adaptability of the microcontroller for future enhancements.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm enables high-density PCB designs and reduces PCB footprint, making this microcontroller suitable for compact devices.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and assembly, requiring standard precautions to prevent damage.

Speed: 25 rpm

With a speed rating of 25rpm, this microcontroller is capable of processing instructions quickly and efficiently, making it suitable for time-critical applications.

No. of I/O Lines: 56

With 56 I/O lines, this microcontroller offers ample connectivity for interfacing with external devices and peripherals, making it versatile for a wide range of applications.

Technical Specifications

Microcontrollers LM3S2139-IBZ25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2139-IBZ25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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