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LM3S1Z16-IQR50-C5

Texas Instruments

LM3S1Z16-IQR50-C5 by Texas Instruments

LM3S1Z16-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 6144 bytes of RAM, FLASH ROM programmability, and supports ADC and DMA channels. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,604 parts In-Stock

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Digiode

USA . 3,890 parts In-Stock

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3,890

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Distributors (Availability)

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One Stop Electronics

USA . 911 parts In-Stock

1+ parts

$10.000

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911

$10.000

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AZTECH Wire

Italy . 220 parts In-Stock

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$13.828

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220

$13.828

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Parana Technologies

USA . 1,469 parts In-Stock

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$73.944

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1,469

$73.944

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DigiPath Technology Company

USA . 1,853 parts In-Stock

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$81.421

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1,853

$81.421

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ChromeModa Solutions

Germany . 1,370 parts In-Stock

1+ parts

$83.083

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$68.128

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1,370

$83.083

$68.128

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IDEA Electronic Components Group

UK . 282 parts In-Stock

1+ parts

$83.083

100+ parts

$78.929

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$74.775

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282

$83.083

$78.929

$74.775

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Corphita

USA . 2,183 parts In-Stock

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Microchip USA

USA . 345 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S1Z16-IQR50-C5 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that are perfect for a wide range of applications. With its advanced features and reliable performance, this microcontroller offers unparalleled value to customers. Whether you're working on robotics, automation, or IoT projects, the LM3S1Z16-IQR50-C5 is the perfect choice to bring your ideas to life. Experience the benefits of cutting-edge technology and seamless integration with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Bit Size: 32

A 32-bit microcontroller offers higher computational capabilities compared to lower-bit models.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for flexibility in design and compatibility with different systems.

No. of Terminals: 64

Higher number of terminals allow for more I/O connections, expanding the capabilities of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack design is space-efficient and easy to handle during assembly.

Minimum Supply Voltage: 3 V

Allows operation at lower voltages, conserving power and improving efficiency.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and energy efficiency for embedded applications.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU for optimized performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances connectivity.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low profile design facilitates compact device designs and space-constrained applications.

Width: 10 mm

Compact width dimension enables integration into small form factor devices.

Maximum Clock Frequency: 16 MHz

Capable of high clock speeds for swift data processing and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 30

Resilient to reflow soldering processes, ensuring reliable manufacturing assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering without compromising functionality.

Length: 10 mm

Compact length dimension for space-saving board designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, offering dedicated processing capabilities for embedded systems.

RAM Bytes: 6144

Generous RAM capacity for data storage and manipulation, supporting complex algorithms and multitasking.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminals ensure secure mechanical connections during soldering and handling.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable performance.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals for motor control and power management.

ROM Programmability: FLASH

Flash ROM allows for easy and fast programming of the microcontroller for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and connectivity on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates resistance to moisture absorption, ensuring reliability in humid environments.

Speed: 50 rpm

Operates at a moderate speed suitable for a wide range of applications without excessive power consumption.

No. of I/O Lines: 33

Sufficient number of I/O lines for interfacing with external devices and peripherals, enhancing versatility.

Technical Specifications

Microcontrollers LM3S1Z16-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1Z16-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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