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LM3S1R26-IQR80-C3

Texas Instruments

LM3S1R26-IQR80-C3 by Texas Instruments

LM3S1R26-IQR80-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple ADC/DMA channels. With a package style of FLATPACK and terminal pitch of 0.5 mm, it offers compact design flexibility for various electronic devices.

Median Price

$5.430

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$5.430

1k+ parts

$4.860

10k+ parts

$4.580

25

-

$5.430

$4.860

$4.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,235 parts In-Stock

1+ parts

$5.748

100+ parts

-

1k+ parts

-

10k+ parts

-

3,235

$5.748

-

-

-

Vyrian

USA . 7,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,920

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 405 parts In-Stock

1+ parts

$5.445

100+ parts

-

1k+ parts

-

10k+ parts

-

405

$5.445

-

-

-

Parana Technologies

USA . 1,041 parts In-Stock

1+ parts

$18.113

100+ parts

-

1k+ parts

$18.257

10k+ parts

-

1,041

$18.113

-

$18.257

-

DigiPath Technology Company

USA . 1,079 parts In-Stock

1+ parts

$19.945

100+ parts

$18.349

1k+ parts

-

10k+ parts

-

1,079

$19.945

$18.349

-

-

ChromeModa Solutions

Germany . 1,909 parts In-Stock

1+ parts

$20.352

100+ parts

$16.689

1k+ parts

-

10k+ parts

-

1,909

$20.352

$16.689

-

-

IDEA Electronic Components Group

UK . 1,458 parts In-Stock

1+ parts

$20.352

100+ parts

$19.334

1k+ parts

$18.317

10k+ parts

-

1,458

$20.352

$19.334

$18.317

-

AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$20.520

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$20.520

-

-

-

Kepictronics

USA . 258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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258

-

-

-

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Microchip USA

USA . 161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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161

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-

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-

Overview

Unlock endless possibilities with the LM3S1R26-IQR80-C3 microcontroller from Texas Instruments. Renowned for its high-quality manufacturing standards, this powerful device offers a wide range of applications in various industries. With cutting-edge technology and reliable performance, this microcontroller provides unmatched value and benefits to customers looking to streamline their processes and enhance efficiency. Experience the advantages of seamless integration, advanced features, and superior functionality with the LM3S1R26-IQR80-C3 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology makes the product easy to assemble on circuit boards, saving space and allowing for compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input and compatibility with other components.

Package Shape: SQUARE

The square shape provides a uniform footprint for easy mounting and integration into designs.

Bit Size: 32

A 32-bit processor allows for faster and more efficient data processing, enhancing the performance of the product.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options allows for versatility in different applications and power requirements.

No. of Terminals: 64

A high number of terminals provide ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

The flatpack design offers a low profile and compact form factor, suitable for space-constrained applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, expanding the product's functionality.

DMA Channels: YES

Direct memory access channels improve data transfer speed and efficiency, enhancing the overall performance of the product.

ROM Words: 262144

Large ROM capacity provides ample storage for program instructions and data, enabling complex applications to be run on the product.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact and slim designs, ideal for thin and portable devices.

Width: 14 mm

The compact width of the product makes it suitable for small form factor designs and space-constrained applications.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency enables fast data processing and execution of instructions, improving the overall performance of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation and performance in harsh industrial environments.

RAM Bytes: 49152

Large RAM capacity allows for efficient data storage and manipulation, enabling the product to handle complex tasks and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy efficient and reliable.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent performance and reliable operation of the product.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of connected devices and peripherals, enhancing the product's versatility.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the product's firmware, ensuring flexibility and adaptability.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and compact PCB designs, maximizing space efficiency.

No. of I/O Lines: 33

A high number of I/O lines provide ample connectivity options and flexibility for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1R26-IQR80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1R26-IQR80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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