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LM3S1P51-IQC80-C3

Texas Instruments

LM3S1P51-IQC80-C3 by Texas Instruments

LM3S1P51-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, 24576 RAM bytes, and 65536 ROM words. It operates at a max clock frequency of 16 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,324 parts In-Stock

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Digiode

USA . 2,971 parts In-Stock

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One Stop Electronics

USA . 1,026 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 450 parts In-Stock

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$6.856

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Parana Technologies

USA . 2,363 parts In-Stock

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$69.727

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DigiPath Technology Company

USA . 664 parts In-Stock

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$76.778

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$70.636

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664

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IDEA Electronic Components Group

UK . 621 parts In-Stock

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$78.345

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$74.428

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$70.510

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621

$78.345

$74.428

$70.510

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ChromeModa Solutions

Germany . 590 parts In-Stock

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$78.345

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$64.243

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Corphita

USA . 2,172 parts In-Stock

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Kepictronics

USA . 354 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

Germany . 248 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1P51-IQC80-C3 microcontroller from Texas Instruments. Built with precision and reliability, this powerhouse is perfect for a wide range of applications. Whether you're designing cutting-edge robotics or innovative IoT devices, this microcontroller delivers unmatched performance. With its advanced features and top-notch quality, Texas Instruments ensures that you get the best value for your investment. Elevate your projects to new heights with the LM3S1P51-IQC80-C3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the microcontroller lightweight and easy to handle, suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and compact integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can support a range of power requirements and is versatile for different projects.

Bit Size: 32

The 32-bit architecture of this microcontroller provides enhanced processing capabilities and performance for demanding applications.

Power Supplies (V): 1.2,3.3

Supporting multiple power supply voltages (1.2V and 3.3V) allows for flexibility in designing and powering the microcontroller in various scenarios.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other components, peripherals, and sensors in complex systems.

ADC Channels: YES

The inclusion of ADC channels enables analog-to-digital conversion, expanding the range of signals that can be processed by the microcontroller.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 65536

The generous ROM capacity of 65,536 words provides ample storage for program code, allowing for the implementation of complex algorithms and applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller can withstand a wide temperature range (-40°C to 85°C) and is suitable for rugged applications.

RAM Bytes: 24576

With 24,576 bytes of RAM, this microcontroller can efficiently store and manipulate data during program execution, enhancing computational capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

PWM Channels: YES

The presence of PWM channels allows for precise control of output signals, making the microcontroller suitable for applications requiring analog output modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and rapid updates to the microcontroller firmware, facilitating firmware development and bug fixes.

Technical Specifications

Microcontrollers LM3S1P51-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1P51-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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