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LM3S1N16-IQR50-C3

Texas Instruments

LM3S1N16-IQR50-C3 by Texas Instruments

LM3S1N16-IQR50-C3 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 12288 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing and precise control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,195 parts In-Stock

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Digiode

USA . 4,668 parts In-Stock

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4,668

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Distributors (Availability)

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AZTECH Wire

Italy . 833 parts In-Stock

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$6.509

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833

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One Stop Electronics

USA . 914 parts In-Stock

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$14.000

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914

$14.000

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Parana Technologies

USA . 990 parts In-Stock

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$54.858

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DigiPath Technology Company

USA . 522 parts In-Stock

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$60.405

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522

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ChromeModa Solutions

Germany . 604 parts In-Stock

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$61.638

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$50.543

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$61.638

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IDEA Electronic Components Group

UK . 19 parts In-Stock

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$61.638

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$58.556

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$55.474

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19

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$55.474

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Lixinc

USA . 7,909 parts In-Stock

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Microchip USA

USA . 4,390 parts In-Stock

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Corphita

USA . 1,353 parts In-Stock

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Kepictronics

USA . 464 parts In-Stock

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Overview

Upgrade your projects with the Texas Instruments LM3S1N16-IQR50-C3 microcontroller, designed to deliver top-notch performance and reliability. With Texas Instruments' renowned reputation for quality, this microcontroller guarantees superior functionality in various applications. Whether you're working on industrial automation, consumer electronics, or automotive systems, the LM3S1N16-IQR50-C3 offers unmatched value with its advanced features and benefits. Trust Texas Instruments to provide cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power requirements.

Package Shape: SQUARE

Square package shape allows for efficient use of board space, making it ideal for compact designs.

Bit Size: 32

32-bit architecture provides high processing power and performance for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in design and integration with different components.

No. of Terminals: 64

64 terminals offer ample connectivity options for interfacing with peripherals and external devices.

Package Style (Meter): FLATPACK

Flatpack package style provides a low profile and efficient heat dissipation, suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold environments without impacting performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring robust connections.

ADC Channels: YES

Built-in ADC channels enable analog to digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers increased stability and reliability in PCB mounting and soldering.

ROM Words: 65536

Large ROM capacity provides ample storage for program code and data, supporting complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low seated height saves space on the PCB and allows for compact device designs.

Width: 10 mm

Narrow width facilitates efficient board layout and component placement, optimizing space utilization.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing and execution of instructions, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering process ensures proper solder joint formation and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering processes for RoHS compliance.

Length: 10 mm

Compact length contributes to overall small footprint and space-saving design solutions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller architecture integrates multiple peripherals for versatile system control and functionality.

RAM Bytes: 12288

Generous RAM capacity provides ample working memory for data storage and temporary variables, supporting multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mounting and rework, enhancing manufacturing and assembly processes.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

PWM channels enable precise control of analog signals and motor speed, essential for many embedded applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, facilitating product customization and maintenance.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high packing density and allows for miniaturization of PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Speed: 50 rpm

Operating speed of 50 rpm offers fast data processing and control, suitable for real-time applications and motor control.

No. of I/O Lines: 33

Abundant I/O lines provide versatile connectivity options for interfacing with external devices and peripherals, enhancing system integration capabilities.

Technical Specifications

Microcontrollers LM3S1N16-IQR50-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1N16-IQR50-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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