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LM3S1J16-IQR50-C1

Texas Instruments

LM3S1J16-IQR50-C1 by Texas Instruments

LM3S1J16-IQR50-C1 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality. The package style is flatpack with a terminal pitch of 0.5 mm, making it compact and versatile for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,932 parts In-Stock

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4,932

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Vyrian

USA . 2,706 parts In-Stock

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2,706

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 584 parts In-Stock

1+ parts

$5.689

100+ parts

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584

$5.689

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One Stop Electronics

USA . 1,067 parts In-Stock

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$27.000

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1,067

$27.000

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Parana Technologies

USA . 1,861 parts In-Stock

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$63.564

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1,861

$63.564

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DigiPath Technology Company

USA . 1,751 parts In-Stock

1+ parts

$69.992

100+ parts

$64.392

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1,751

$69.992

$64.392

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ChromeModa Solutions

Germany . 5,943 parts In-Stock

1+ parts

$71.420

100+ parts

$58.564

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5,943

$71.420

$58.564

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

1+ parts

$71.420

100+ parts

$67.849

1k+ parts

$64.278

10k+ parts

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1,259

$71.420

$67.849

$64.278

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Corphita

USA . 1,333 parts In-Stock

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1,333

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Microchip USA

USA . 441 parts In-Stock

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441

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Overview

Experience the cutting-edge technology of the Texas Instruments LM3S1J16-IQR50-C1 microcontroller, a top-quality product designed to meet the demands of industrial applications. With 32-bit architecture and a wide range of power supplies, this device offers unmatched performance and versatility. Whether you're developing IoT devices, robotics, or automotive systems, this microcontroller provides the reliability and efficiency you need for your project. Trust Texas Instruments for superior quality and innovation in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability while keeping the overall weight of the product low.

Surface Mount: YES

Surface mount technology makes the product suitable for automated assembly processes, saving time and cost.

Maximum Supply Voltage: 1.32 V

High maximum supply voltage ensures stability and reliability in various operating conditions.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

Bit Size: 32

32-bit architecture provides high processing power and performance for complex applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows flexibility in system design.

No. of Terminals: 64

Ample number of terminals enable connectivity with various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers easy installation and maintenance of the product.

Minimum Supply Voltage: 1.08 V

Low minimum supply voltage ensures energy efficiency and extends battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the product suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows reliable performance in extreme cold conditions.

ADC Channels: YES

Built-in ADC channels enable analog input signal processing for sensor interfacing.

DMA Channels: YES

DMA channels facilitate efficient data transfer between memory and peripherals without CPU intervention.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing of signal traces.

ROM Words: 131072

Large ROM capacity allows for storing firmware, programs, and data for diverse applications.

Maximum Seated Height: 1.6 mm

Low seated height is ideal for slim and compact product designs.

Width: 10 mm

Narrow width contributes to space-saving on the PCB layout.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency ensures efficient and fast processing of data and instructions.

Length: 10 mm

Compact length enables the product to fit in constrained spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller peripheral IC type integrates various functions like CPU, memory, and I/O interfaces for standalone operation.

RAM Bytes: 20480

Large RAM capacity facilitates efficient data processing and storage during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder joints for durability.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and prevents damage to the product.

PWM Channels: YES

PWM channels enable precise control of analog outputs like motor speed and LED brightness.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to firmware and programs.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB design.

Speed: 50 rpm

High speed capability enables fast data processing and response times.

No. of I/O Lines: 33

Sufficient number of I/O lines allow for versatile connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1J16-IQR50-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1J16-IQR50-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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