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LM3S1J11-IQC50-C1

Texas Instruments

LM3S1J11-IQC50-C1 by Texas Instruments

Texas Instruments' LM3S1J11-IQC50-C1 microcontroller features 32-bit architecture, 131072 ROM words, and 20480 RAM bytes. With ADC and DMA channels, it operates in industrial temperatures (-40 to 85 °C) for various applications like PWM control and data acquisition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,936 parts In-Stock

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Digiode

USA . 3,036 parts In-Stock

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3,036

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Distributors (Availability)

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AZTECH Wire

Italy . 717 parts In-Stock

1+ parts

$9.687

100+ parts

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717

$9.687

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One Stop Electronics

USA . 1,371 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 1,303 parts In-Stock

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$45.372

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$45.372

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DigiPath Technology Company

USA . 1,413 parts In-Stock

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$49.960

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1,413

$49.960

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ChromeModa Solutions

Germany . 3,752 parts In-Stock

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$50.980

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$41.804

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3,752

$50.980

$41.804

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IDEA Electronic Components Group

UK . 111 parts In-Stock

1+ parts

$50.980

100+ parts

$48.431

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$45.882

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111

$50.980

$48.431

$45.882

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Corphita

USA . 4,335 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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Overview

Experience the next level of innovation with the LM3S1J11-IQC50-C1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers exceptional performance and functionality. With features like ADC channels, DMA channels, PWM channels, and more, this product provides unmatched value and benefits to customers. Upgrade your projects with the LM3S1J11-IQC50-C1 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, preventing damage from excessive voltage.

Package Shape: SQUARE

Facilitates a compact and space-efficient design for the microcontroller, making it suitable for small devices.

Bit Size: 32

Offers high computational capabilities and performance for processing tasks efficiently.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, allowing flexibility in different applications and environments.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter): FLATPACK

Facilitates easy integration and mounting onto circuit boards, enhancing the overall design and layout.

Minimum Supply Voltage: 1.08 V

Ensures reliable operation of the microcontroller even at low voltage conditions, improving overall performance.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to function effectively in high-temperature environments without experiencing issues.

Minimum Operating Temperature: -40 °C

Ensures the microcontroller can operate in harsh, cold conditions without any operational limitations.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with analog sensors and devices in various applications.

DMA Channels: YES

Facilitates efficient data transfer and processing, reducing the load on the CPU and enhancing overall system performance.

Terminal Position: QUAD

Provides multiple terminal positions for easy soldering and connectivity, enhancing ease of use during assembly.

ROM Words: 131072

Offers a large memory capacity for storing program instructions and data, enabling complex applications to be executed efficiently.

Maximum Seated Height: 1.6 mm

Ensures a low profile for the microcontroller, making it suitable for slim and compact device designs.

Width: 14 mm

Provides a compact footprint for the microcontroller, enabling it to fit into tight spaces within electronic devices.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed operation for processing tasks quickly and efficiently, improving overall system performance.

Length: 14 mm

Offers a square form factor for the microcontroller, ensuring a balanced design for optimal integration within devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, making it suitable for rugged and demanding applications.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, offering a wide range of features and capabilities for various embedded applications.

RAM Bytes: 20480

Provides ample memory for data storage and processing, enabling efficient multitasking and data handling.

Technology: CMOS

Utilizes CMOS technology, known for low power consumption and high noise immunity, improving energy efficiency and reliability.

Terminal Form: GULL WING

Facilitates easy soldering and connectivity with circuit boards, enhancing the overall reliability and durability of the connections.

Nominal Supply Voltage: 1.2 V

Offers a stable voltage supply for optimal performance and reliability, ensuring consistent operation of the microcontroller.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) output, essential for controlling motor speeds and other analog functions in various applications.

ROM Programmability: FLASH

Allows for reprogramming of the ROM memory, enabling flexibility and adaptability for different applications and firmware updates.

Terminal Pitch: 0.5 mm

Provides precise terminal spacing for easy soldering and connection, ensuring reliable electrical connections in the system.

Speed: 50 rpm

Offers a high-speed processing capability, suitable for applications requiring quick response times and data processing.

No. of I/O Lines: 67

Provides a sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing connectivity options.

Technical Specifications

Microcontrollers LM3S1J11-IQC50-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1J11-IQC50-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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