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LM3S1D21-IBZ80-A1

Texas Instruments

LM3S1D21-IBZ80-A1 by Texas Instruments

LM3S1D21-IBZ80-A1 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 16.384 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a low-profile package with a square shape and grid array style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,194 parts In-Stock

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Digiode

USA . 1,009 parts In-Stock

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1,009

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Distributors (Availability)

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AZTECH Wire

Italy . 796 parts In-Stock

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$14.448

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796

$14.448

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One Stop Electronics

USA . 146 parts In-Stock

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$29.000

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$29.000

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Parana Technologies

USA . 1,768 parts In-Stock

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$29.869

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$64.252

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DigiPath Technology Company

USA . 1,562 parts In-Stock

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$32.890

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IDEA Electronic Components Group

UK . 2,291 parts In-Stock

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$33.561

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$31.883

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$30.205

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2,291

$33.561

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ChromeModa Solutions

Germany . 315 parts In-Stock

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$33.561

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$27.520

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315

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Corphita

USA . 4,989 parts In-Stock

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Microchip USA

USA . 130 parts In-Stock

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Overview

Unlock the potential of your projects with the LM3S1D21-IBZ80-A1 microcontroller by Texas Instruments. Known for their high-quality products, Texas Instruments delivers innovative solutions for a wide range of applications. This microcontroller offers customers unmatched value and benefits, with advanced features such as ADC and DMA channels, PWM capabilities, and ROM programmability. Whether you are working on industrial automation, consumer electronics, or IoT devices, this versatile microcontroller is sure to meet your needs. Experience the power and reliability of Texas Instruments with the LM3S1D21-IBZ80-A1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the microcontroller, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Being surface mountable makes it easy to integrate this microcontroller into PCB designs, allowing for efficient assembly and saving valuable space on the board.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance of 3.6 V allows for flexibility in power supply options, accommodating a wide range of voltage inputs without the risk of damage.

Package Shape: SQUARE

The square package shape offers ease of handling and placement during the manufacturing process, simplifying the integration of the microcontroller into electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and data processing tasks with speed and efficiency, making it ideal for demanding applications.

No. of Terminals: 108

Having a high number of terminals provides ample connectivity options for external components and peripherals, enabling versatile functionality and customization in system designs.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch design enhances the overall compactness and reliability of the microcontroller, making it suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3 V ensures efficient power consumption and compatibility with various power sources, enhancing the energy efficiency of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the microcontroller to withstand elevated temperatures without compromising performance, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature from -40°C ensures reliable operation in extreme cold conditions, enhancing the versatility and robustness of the microcontroller.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, facilitating accurate sensor readings and signal processing in various applications.

DMA Channels: YES

The availability of DMA channels allows for direct memory access, enabling efficient data transfer and processing without CPU intervention, enhancing the overall performance and responsiveness of the microcontroller.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and assembly, ensuring easy integration and soldering of the microcontroller onto the board for streamlined manufacturing processes.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5 mm helps reduce the overall profile of the microcontroller package, making it suitable for compact designs and applications where space constraints are a concern.

Width: 10 mm

The compact width of 10 mm allows for space-efficient placement of the microcontroller on the PCB, enabling dense circuit layouts and accommodating tight design requirements in electronic devices.

Maximum Clock Frequency: 16.384 MHz

With a high maximum clock frequency of 16.384 MHz, this microcontroller can handle fast computational tasks and real-time processing, making it suitable for applications that require high-speed operation.

Length: 10 mm

The short length of 10 mm contributes to the overall compactness of the microcontroller package, enabling efficient use of board space and easy integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable operation of the microcontroller in harsh environmental conditions, making it suitable for industrial and ruggedized applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with extensive peripheral support, this product offers efficient and streamlined processing capabilities for a wide range of embedded applications, enhancing performance and versatility.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term operation in various electronic devices.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and ensures secure electrical connections, enhancing the reliability and durability of the microcontroller when integrated into PCB designs.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage specification provides stable and consistent power delivery to the microcontroller, ensuring reliable performance and compatibility with standard power sources.

PWM Channels: YES

The availability of PWM channels enables precise control over pulse width modulation signals, allowing for accurate regulation of motor speeds, LED brightness, and other analog applications.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy and flexible firmware updates and customization, enabling users to modify and upgrade the microcontroller's functionality as needed.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8 mm, this microcontroller is suitable for high-density PCB designs, offering enhanced connectivity options and efficient signal routing for complex electronic systems.

Speed: 80 rpm

The speed specification of 80 rpm indicates the processing speed of the microcontroller, allowing for rapid execution of instructions and tasks, making it ideal for applications requiring high-speed performance.

No. of I/O Lines: 67

Having 67 I/O lines provides ample input and output options for connecting external devices and sensors, enabling versatile interfacing capabilities and customization in system designs.

Technical Specifications

Microcontrollers LM3S1D21-IBZ80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1D21-IBZ80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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