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LM3S1B21-IQC80-C5T

Texas Instruments

LM3S1B21-IQC80-C5T by Texas Instruments

LM3S1B21-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. Operating at a max clock frequency of 16 MHz, it features ADC and DMA channels for industrial applications requiring high-speed processing and precise data acquisition. With a package style of FLATPACK, this Cortex-M3 CPU family device offers 67 I/O lines and PWM channels for versatile connectivity options in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,871 parts In-Stock

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5,871

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Digiode

USA . 608 parts In-Stock

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608

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$17.667

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803

$17.667

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One Stop Electronics

USA . 1,124 parts In-Stock

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$29.000

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1,124

$29.000

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Parana Technologies

USA . 1,197 parts In-Stock

1+ parts

$51.406

100+ parts

$4,773.864

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$46.266

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1,197

$51.406

$4,773.864

$46.266

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DigiPath Technology Company

USA . 1,039 parts In-Stock

1+ parts

$56.605

100+ parts

$52.076

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1,039

$56.605

$52.076

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$57.760

100+ parts

$54.872

1k+ parts

$51.984

10k+ parts

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2,282

$57.760

$54.872

$51.984

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ChromeModa Solutions

Germany . 197 parts In-Stock

1+ parts

$57.760

100+ parts

$47.363

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197

$57.760

$47.363

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Corphita

USA . 2,205 parts In-Stock

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Microchip USA

USA . 316 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1B21-IQC80-C5T by Texas Instruments, a top-tier manufacturer renowned for its cutting-edge technology. This microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're designing consumer electronics, industrial automation systems, or automotive devices, this versatile product delivers value, flexibility, and efficiency. Experience seamless operation and superior functionality with the LM3S1B21-IQC80-C5T, setting new standards in microcontroller excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it provides good protection and durability.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of the microcontroller onto a PCB.

Maximum Supply Voltage: 3.6 V

This higher voltage tolerance allows for flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

Square packages are easy to handle and integrate into PCB designs.

Bit Size: 32

A 32-bit microcontroller offers better performance and precision compared to lower bit sizes.

Power Supplies (V): 1.2, 3.3

Multiple power supply options make the microcontroller versatile in various applications.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and versatility in circuit design.

Package Style (Meter): FLATPACK

Flatpack package style is space-efficient and suitable for compact electronic devices.

Minimum Supply Voltage: 3 V

A low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial environments where heat can be a concern.

CPU Family: CORTEX-M3

The Cortex-M3 family of CPUs is known for its performance and energy efficiency, making it a reliable choice for embedded systems.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation even in extreme cold environments.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Quad terminal position offers stable connectivity and ease of soldering during assembly.

ROM Words: 262144

The large ROM capacity allows for storing complex program codes and data.

Maximum Seated Height: 1.6 mm

The low seated height enables slim and compact design of the final product.

Width: 14 mm

A moderate width allows for easy integration into standard PCB layouts.

Maximum Clock Frequency: 16 MHz

A high clock frequency enables fast processing and response times in the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time prevents heat damage during assembly processes.

Peak Reflow Temperature °C: 260

This high peak reflow temperature ensures proper soldering and reliability under thermal stress.

Length: 14 mm

A moderate length allows for flexible placement on the PCB while conserving space.

Temperature Grade: INDUSTRIAL

Being industrial grade means the microcontroller can withstand harsh environmental conditions and extended use.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and processing capabilities in a single chip, reducing component count and complexity.

RAM Bytes: 98304

Large RAM capacity allows for efficient data handling and multitasking in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent performance and operation of the microcontroller.

PWM Channels: YES

PWM channels allow for precise control of analog signals and voltage levels.

ROM Programmability: FLASH

ROM programmable with FLASH technology enables easy and quick updates to the microcontroller's firmware.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density mounting and space-efficient PCB design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's resistance to moisture, ensuring reliability in humid environments.

Speed: 80 rpm

This could be a value not relevant to the microcontroller's operation.

No. of I/O Lines: 67

Having a high number of I/O lines allows for extensive connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers LM3S1B21-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1B21-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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