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LM3S1B21-IQC80-C3

Texas Instruments

LM3S1B21-IQC80-C3 by Texas Instruments

LM3S1B21-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing. With 67 I/O lines and PWM/ADC/DMA channels, it offers versatile connectivity options in a compact square package ideal for embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,419 parts In-Stock

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Digiode

USA . 642 parts In-Stock

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AZTECH Wire

Italy . 772 parts In-Stock

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$5.324

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One Stop Electronics

USA . 562 parts In-Stock

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$6.000

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Parana Technologies

USA . 285 parts In-Stock

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$18.785

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$18.873

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IDEA Electronic Components Group

UK . 2,011 parts In-Stock

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$21.107

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$20.052

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$18.996

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$21.107

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ChromeModa Solutions

Germany . 1,059 parts In-Stock

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$21.107

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$17.308

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Authorized Procurement Solutions

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Corphita

USA . 3,293 parts In-Stock

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DigiPath Technology Company

USA . 2,354 parts In-Stock

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$19.030

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Kepictronics

USA . 330 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the LM3S1B21-IQC80-C3 microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are reliable and versatile. This microcontroller is perfect for a wide range of applications, offering customers exceptional value, benefits, and advantages. Experience seamless performance, high efficiency, and enhanced functionality with this cutting-edge technology. Upgrade your projects with the LM3S1B21-IQC80-C3 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the microcontroller.

Surface Mount: YES

Ease of installation and space-saving design, making it suitable for compact electronic devices.

Maximum Supply Voltage: 3.6 V

Allows for versatile power supply options while still maintaining a safe operating limit.

Bit Size: 32

Higher bit size allows for more complex operations and calculations to be performed by the microcontroller.

Power Supplies (V): 1.2,3.3

Flexible power supply options enable compatibility with various voltage sources, making it suitable for a range of applications.

No. of Terminals: 100

Sufficient number of terminals for connecting external components and peripherals to the microcontroller.

Package Style (Meter): FLATPACK

Flatpack design offers easy integration into electronic circuit boards and efficient heat dissipation.

Minimum Supply Voltage: 3 V

Ensures stable operation even at lower voltage levels, providing reliability in different power supply conditions.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications where temperature fluctuations may occur.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for controlling and managing peripheral devices, making it a versatile choice for various electronic systems.

Technical Specifications

Microcontrollers LM3S1B21-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1B21-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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