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LM3S1968-IBZ50-A2

Texas Instruments

LM3S1968-IBZ50-A2 by Texas Instruments

LM3S1968-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with integrated cache and 108 terminals. It operates at a max frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption. With 8 ADC channels and various peripherals like PWM and UART, it offers versatile connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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North Shore Components

USA . 11,987 parts In-Stock

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Vyrian

USA . 3,986 parts In-Stock

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Digiode

USA . 1,660 parts In-Stock

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1,660

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,439 parts In-Stock

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$5.000

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1,439

$5.000

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One Stop Electronics

USA . 1,537 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 209 parts In-Stock

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$13.136

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209

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Parana Technologies

USA . 404 parts In-Stock

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$54.637

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$5,073.884

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$49.173

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404

$54.637

$5,073.884

$49.173

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DigiPath Technology Company

USA . 1,278 parts In-Stock

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$60.162

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$55.349

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1,278

$60.162

$55.349

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ChromeModa Solutions

Germany . 6,565 parts In-Stock

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$61.390

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$50.340

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$61.390

$50.340

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IDEA Electronic Components Group

UK . 1,041 parts In-Stock

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$61.390

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$58.320

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$55.251

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1,041

$61.390

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$55.251

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Corphita

USA . 4,198 parts In-Stock

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Lixinc

USA . 3,287 parts In-Stock

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Microchip USA

USA . 173 parts In-Stock

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Kepictronics

USA . 40 parts In-Stock

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Overview

Revolutionize your projects with the LM3S1968-IBZ50-A2 microcontroller by Texas Instruments. Designed with cutting-edge technology and unparalleled quality, this device offers a wide range of applications in various industries. With integrated cache, multiple peripherals, and low power mode, this microcontroller provides unmatched value and benefits to customers seeking high performance and reliability. Experience seamless connectivity and exceptional speed with this top-of-the-line product, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

The integrated cache helps improve the overall performance of the microcontroller by storing frequently accessed data for faster retrieval.

Maximum Supply Voltage: 2.75 V

This voltage limit ensures safe operation of the microcontroller and prevents damage from overvoltage.

On Chip Data RAM Width: 8

With a data RAM width of 8, the microcontroller can efficiently process and store data during operations.

Bit Size: 32

The 32-bit architecture of the microcontroller allows for faster and more efficient processing of instructions and data.

ROM Words: 262144

The large ROM size provides ample space for program storage, allowing for complex applications to be run on the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it is optimized for handling a large number of instructions efficiently, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in operation.

Analog To Digital Convertors: 8-Ch 10-Bit

The ADC channels allow the microcontroller to convert analog signals into digital data, enabling it to interface with various sensors and peripherals.

No. of Serial I/Os: 6

Having 6 serial I/Os provides flexibility for connecting to external devices, expanding the microcontroller's capabilities and compatibility.

Technical Specifications

Microcontrollers LM3S1968-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

6

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(3)

Peripherals:

PWM(6), QEI(2), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1968-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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